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| 型号： | NBSG53ABAEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 13/18页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL BBG NBSG53ABA |
| 产品变化通告： | Product Discontinuation 21/Jun/2007 |
| 标准包装： | 1 |
| 其它名称： | NBSG53ABAEVB-ND NBSG53ABAEVBOS |
NBSG53A
http://onsemi.com
4
Table 5. ATTRIBUTES
Characteristics
Value
Positive Operating Voltage Range for VCC (VEE = 0 V)
2.375 V to 3.465 V
Negative Operating Voltage Range for VEE (VCC = 0 V)
2.375 V to 3.465 V
Internal Input Pulldown Resistor (R, SEL)
75 kW
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 1.5 kV
> 50 V
> 4 kV
Moisture Sensitivity (Note 5)
FCBGA16
16QFN
Level 3
Level 1
Flammability Rating
UL 94 V0 @ 0.125 in
Oxygen Index
28 to 34
Transistor Count
482
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
5. For additional information, refer to Application Note AND8003/D.
Table 6. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VCC
Positive Power Supply
VEE = 0 V
3.6
V
VEE
Negative Power Supply
VCC = 0 V
3.6
V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
3.6
V
VINPP
Differential Input Voltage
|D D| VCC VEE w 2.8 V
VCC VEE <
2.8 V
2.8
|VCC VEE|
V
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
45
80
mA
IOUT
Output Current
Continuous
Surge
25
50
mA
TA
Operating Temperature Range
FCBGA16
QFN16
40 to +70
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
(Note 6)
0 lfpm
500 lfpm
0 lfpm
500 lfpm
FCBGA16
QFN16
108
86
41.6
35.2
°C/W
qJC
Thermal Resistance (JunctiontoCase)
2S2P (Note 6)
2S2P (Note 7)
FCBGA16
QFN16
5.0
4.0
°C/W
Tsol
Wave Solder
Pb
PbFree
< 3 sec @ 248°C
< 3 sec @ 260°C
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
6. JEDEC standard 516, multilayer board 2S2P (2 signal, 2 power).
7. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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