参数资料
型号: NCP1252TSFWDGEVB
厂商: ON Semiconductor
文件页数: 17/18页
文件大小: 0K
描述: BOARD DEMO NCP1252 PWM CTLR
设计资源: NCP1252TSFWDGEVB Schematic
NCP1252TSFWDGEVB Gerber Files
NCP1252TSFWDGEVB Bill of Materials
标准包装: 1
主要目的: AC/DC,主面
输出及类型: 1,隔离
输出电压: 12V
电流 - 输出: 10A
稳压器拓扑结构: 正向转换器
板类型: 完全填充
已供物品:
已用 IC / 零件: NCP1252
其它名称: NCP1252TSFWDGEVB-ND
NCP1252TSFWDGEVBOS
NCP1252
PACKAGE DIMENSIONS
8 LEAD PDIP
CASE 626 ? 05
ISSUE N
NOTE 8
A1
D1
8
1
e/2
e
D
TOP VIEW
5
4
b2
A
E1
B
A2
A
L
8X b
H
NOTE 3
SEATING
PLANE
C
E
c
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
M
eB
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS ? 3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
MILLIMETERS
DIM
MIN MAX
MIN MAX
???? 0.210
??? 5.33
A
0.015 ????
0.38 ???
A1
0.115 0.195
2.92 4.95
A2
0.014 0.022
0.35 0.56
b
0.060 TYP
1.52 TYP
b2
0.008 0.014
0.20 0.36
C
0.355 0.400
9.02 10.16
D
0.005 ????
0.13 ???
D1
0.300 0.325
7.62 8.26
E
0.240 0.280
6.10 7.11
E1
0.100 BSC
2.54 BSC
e
???? 0.430
??? 10.92
eB
0.115 0.150
2.92 3.81
L
???? 10 °
??? 10 °
M
SIDE VIEW
0.010
M
C A
M
B
M
NOTE 6
http://onsemi.com
17
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