参数资料
型号: NCP1294EDBR2G
厂商: ON Semiconductor
文件页数: 1/13页
文件大小: 0K
描述: IC PWM CTLR FLYBACK 16TSSOP
标准包装: 2,500
输出隔离: 隔离
频率范围: 260kHz ~ 320kHz
输入电压: 4.7 V ~ 15 V
工作温度: -40°C ~ 125°C
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 带卷 (TR)
NCP1294
Flyback, Boost, Forward
PWM Controller
The NCP1294 fixed frequency feed forward voltage mode PWM
controller contains all of the features necessary to be configured in a
Flyback, Boost or Forward topology. This PWM controller has been
optimized for high frequency primary side control operation. In
http://onsemi.com
addition, this device includes such features as: Soft ? Start, accurate
duty cycle limit control, less than 50 m A startup current, over and
undervoltage protection, and bidirectional synchronization. The
NCP1294 is available in a 16 lead SOIC narrow surface mount
16
1
SOIC ? 16
D SUFFIX
CASE 751B
package.
G
Features
? 1.0 MHz Frequency Capability
? Fixed Frequency Voltage Mode Operation, with Feed Forward
? Thermal Shutdown
? Undervoltage Lock ? Out
? Accurate Programmable Max Duty Cycle Limit
? 1.0 A Sink/Source Gate Drive
? Programmable Pulse ? By ? Pulse Overcurrent Protection
? Leading Edge Current Sense Blanking
? 75 ns Shutdown Propagation Delay
? Programmable Soft ? Start
? Undervoltage Protection
? Overvoltage Protection with Programmable Hysteresis
? Bidirectional Synchronization
? 25 ns GATE Rise and Fall Time (1.0 nF Load)
? 3.3 V 3% Reference Voltage Output
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
16
TSSOP ? 16
DB SUFFIX
CASE 948F
1
PIN CONNECTIONS AND
MARKING DIAGRAM
1 16
GATE V C
I SENSE PGND
SYNC V CC
FF V REF
UV LGND
OV SS
R T C T COMP
I SET V FB
16
NCP
1294
ALYW
1
NCP1294= Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G
= Pb ? Free Package
ORDERING INFORMATION
Device
NCP1294EDR2G
Package
SOIC ? 16
(Pb ? Free)
Shipping ?
2500 Tape & Reel
NCP1294EDBR2G TSSOP ? 16
(Pb ? Free)
2500 Tape & Reel
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2009
July, 2009 ? Rev. 0
1
Publication Order Number:
NCP1294/D
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