- 您现在的位置：买卖IC网 > PDF目录13310 > NCP1595MNT2G (ON Semiconductor)IC REG BUCK SYNC ADJ 1.5A 6DFN PDF资料下载
参数资料
| 型号： | NCP1595MNT2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 1.5A 6DFN |
| 标准包装： | 3,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 可调至 0.8V |
| 输入电压： | 4 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 1MHz |
| 电流 - 输出： | 1.5A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-VDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 6-DFN（3x3） |
NCP1595, NCP1595A, NCP1595C
Calculate the power lost in the NCP1595/A/C using the
following equations:
1. High side MOSFET
q JC is the junction ? to ? case thermal resistance equal to
1.7 ° C/W. T C is the temperature of the case and TJ is the
junction temperature, or die temperature. The
P HSON + I
R DS(on)HS
The conduction loss in the top switch is:
2
RMS_HSFET
(eq. 8)
case ? to ? ambient thermal resistance is dependent on how
well heat can be transferred from the PC board to the air.
Solder the underside ? exposed pad to a large copper GND
Where:
I RMS_FET +
I out 2 )
D I PP
12
2
D
(eq. 9)
plane. If the die temperature reaches +185 ° C the
NCP1595/A/C shut down and does not restart again until the
die temperature cools by 40 ° C.
Layout Consideration
D I PP is the peak ? to ? peak inductor current ripple.
The power lost due to switching the internal power high side
MOSFET is:
As with all high frequency switchers, when considering
layout, care must be taken in order to achieve optimal
electrical, thermal and noise performance. For 1.0MHz
switching frequency, switch rise and fall times are typically
P HSSW +
V in @ I out @ t r ) t f @ f SW
2
(eq. 10)
in few nanosecond range. To prevent noise both radiated and
conducted the high speed switching current path must be
kept as short as possible. Shortening the current path will
t r and t f are the rise and fall times of the internal power
MOSFET measured at SW node.
2. Low side MOSFET
The power dissipated in the top switch is:
P LSON + I RMS_LSFET 2 @ R DS(on)LS (eq. 11)
Where:
also reduce the parasitic trace inductance of approximately
25 nH/inch. At switch off, this parasitic inductance
produces a flyback spike across the NCP1595/A/C switch.
When operating at higher currents and input voltages, with
poor layout, this spike can generate voltages across the
NCP1595/A/C that may exceed its absolute maximum
rating. A ground plane should always be used under the
switcher circuitry to prevent interplane coupling and overall
I RMS_LSFET +
I out 2 )
D I PP
12
2
@ (1 * D )
(eq. 12)
noise.
The FB component should be kept as far away as possible
from the switch node. The ground for these components
D I PP is the peak ? to ? peak inductor current ripple.
The switching loss for the low side MOSFET can be
ignored.
The power lost due to the quiescent current (I Q ) of the device
is:
P Q + V in @ I Q (eq. 13)
I Q is the switching quiescent current of the NCP1595/A/C.
P TOTAL + P HSON ) P HSSW ) P LSON ) P Q (eq. 14)
Calculate the temperature rise of the die using the following
equation:
should be separated from the switch current path. Failure to
do so will result in poor stability or subharmonic like
oscillation.
Board layout also has a significant effect on thermal
resistance. Reducing the thermal resistance from ground pin
and exposed pad onto the board will reduce die temperature
and increase the power capability of the NCP1595/A/C. This
is achieved by providing as much copper area as possible
around the exposed pad. Adding multiple thermal vias under
and around this pad to an internal ground plane will also
help. Similar treatment to the inductor pads will reduce any
additional heating effects.
T J + T C ) P TOTAL @ q JC
(eq. 15)
http://onsemi.com
12
相关PDF资料 |
PDF描述 |
|---|---|
| VE-B6Y-EX-F4 | CONVERTER MOD DC/DC 3.3V 49.5W |
| VI-J0B-EX-F3 | CONVERTER MOD DC/DC 95V 75W |
| EMA32DRMH-S288 | CONN EDGECARD 64POS .125 EXTEND |
| ESM24DSEF-S13 | CONN EDGECARD 48POS .156 EXTEND |
| VE-27Z-EX-F1 | CONVERTER MOD DC/DC 2V 30W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NCP1596AMNTWG | 功能描述:电流型 PWM 控制器 1.5A BUCK DOWN CONVERTER RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| NCP1597AGEVB | 功能描述:电源管理IC开发工具 EVB RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| NCP1597AMNTWG | 功能描述:直流/直流开关调节器 BUCK REGULATOR RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| NCP1597BGEVB | 功能描述:电源管理IC开发工具 EVB RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| NCP1597BMNTWG | 功能描述:直流/直流开关调节器 SYNC BUCK CONTROLLER RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
发布紧急采购，3分钟左右您将得到回复。