参数资料
| 型号： | NCP2824FCT2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | IC AMP MONO CLASS D AGC 9-WCSP |
| 标准包装： | 1 |
| 系列： | NOCAP™ |
| 类型： | D 类 |
| 输出类型： | 1-通道（单声道） |
| 在某负载时最大输出功率 x 通道数量： | 2.4W x 1 @ 4 欧姆 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 特点： | 差分输入，短路和热保护 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 9-覆晶 |
| 封装/外壳： | 9-WFBGA，FCBGA |
| 包装： | 标准包装 |
| 其它名称： | NCP2824FCT2GOSDKR |
NCP2824
http://onsemi.com
3
Table 1. PIN FUNCTION DESCRIPTION
Pin
Name
Type
Description
A1
INP
Input
Positive Input
C1
INN
Input
Negative Input
A2
PVDD
POWER
Power Supply: This pin is the power supply of the device. A 4.7 mF ceramic capacitor or larger must
bypass this input to the ground. This capacitor should be placed as close a possible to this input.
B2
NC
Nonconnected: reserved for production. Must be kept floating in the final application
A3
OUTP
Output
Positive output: Special care must be observed at layout level. See the Layout consideration section
C3
OUTN
Output
Negative output: Special care must be observed at layout level. See the Layout consideration section
C2
CNTL
Input
Control: This pin is dedicated to the control of the chip via the Single wire protocol
B3
PGND
POWER
Power Ground: This pin is the power ground and carries the high switching current. A high quality
ground must be provided to avoid any noise spikes/uncontrolled operation. Care must be observed to
avoid highdensity current flow in a limited PCB copper track.
B1
AGND
POWER
Analog Ground: This pin is the analog ground of the device and must be connected to GND plane.
Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
AVDD, PVDD Pins: Power Supply Voltage (Note 2)
VDD
0.3 to +6.0
V
INP/N Pins: Input (Note 2)
VINP/N
0.3 to +VDD
V
Digital Input/Output: EN Pin:
Input Voltage
Input Current
VDG
IDG
0.3 to VDD + 0.3
1
V
mA
Human Body Model (HBM) ESD Rating are (Note 3)
ESD HBM
2000
V
Machine Model (MM) ESD Rating are (Note 3)
ESD MM
200
V
Thermal Resistance Junction to Case
RqJC
90
°C/W
Operating Ambient Temperature Range
TA
40 to +85
°C
Operating Junction Temperature Range
TJ
40 to +125
°C
Maximum Junction Temperature (Note 6)
TJMAX
+150
°C
Storage Temperature Range
TSTG
65 to +150
°C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22A115 for all pins.
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: JSTD020A.
6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The RqCA is dependent on the PCB heat dissipation. The maximum power dissipation (PD) is dependent on the min input voltage, the max
output current and external components selected.
RqCA +
125 * TA
PD
* RqJC
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