参数资料
| 型号： | NCP330MUTBG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/9页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH FET 3A 4UDFN |
| 标准包装： | 3,000 |
| 系列： | * |
NCP330
MAXIMUM RATINGS
Rating
IN, OUT, EN, Pins:
From IN to OUT Pins: Input/Output
ESD Withstand Voltage (IEC 61000 ? 4 ? 2) (Note 1)
(IN and OUT when bypassed with 1.0 m F capacitor minimum)
Human Body Model (HBM) ESD Rating are (Notes 2 and 3)
Machine Model (MM) ESD Rating are (Notes 2 and 3)
Latch ? up protection (Note 4)
? Pins IN, OUT, EN
Maximum Junction Temperature Range
Storage Temperature Range
Moisture Sensitivity (Note 5)
Symbol
V EN , V IN , V OUT
V IN , V OUT
ESD IEC
ESD HBM
ESD MM
LU
T J
T STG
MSL
Value
? 0.3 to + 7.0
? 7.0 to + 7.0
15 Air, 8 contact
4000
200
100
? 40 to + 125
? 40 to + 150
Level 1
Unit
V
V
kV
V
V
mA
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Guaranteed by design.
2. According to JEDEC standard JESD22 ? A108.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ± 2.0 kV per JEDEC standard: JESD22 ? A114 for all pins.
Machine Model (MM) ± 200 V per JEDEC standard: JESD22 ? A115 for all pins.
4. Latch up Current Maximum Rating: ± 100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J ? STD ? 020.
OPERATING CONDITIONS
Symbol
V IN
Parameter
Operational Power Supply
Conditions
Min
1.8
Typ
Max
5.5
Unit
V
V EN
Enable Voltage
0
5.5
T A
T J
C IN
Ambient Temperature Range
Junction Temperature Range
Decoupling input capacitor
? 40
? 40
1
25
25
+ 85
+ 125
° C
° C
m F
C OUT
R q JA
I OUT
I peak
Decoupling output capacitor
Thermal Resistance Junction to Air
Maximum DC current
Maximum Peak current
USB port per Hub
UDFN ? 4 package (Note 6)
UDFN ? 4 package
1 ms at 217 Hz (GSM calibration)
1
170
3
5
m F
° C/W
A
A
P D
Power Dissipation Rating (Note 7)
T A ≤ 25 ° C
UDFN ? 4 package
0.58
W
T A = 85 ° C
UDFN ? 4 package
0.225
6. The R q JA is dependent of the PCB heat dissipation.
7. The maximum power dissipation (P D ) is given by the following formula:
P D +
T JMAX * T A
R q JA
http://onsemi.com
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