参数资料
| 型号： | NCP360MUTBG |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/13页 |
| 文件大小： | 0K |
| 描述： | IC CTLR USB POS OVP FET 6-UDFN |
| 标准包装： | 1 |
| 电压 - 工作： | 1.2 ~ 20V |
| 电压 - 箝位： | 7.4V |
| 技术： | 混合技术 |
| 电路数： | 1 |
| 应用： | USB |
| 封装/外壳： | 6-UDFN 裸露焊盘 |
| 供应商设备封装： | 6-uDFN（2x2） |
| 包装： | 剪切带 (CT) |
| 其它名称： | NCP360MUTBGOSCT |
NCP360, NCV360
MAXIMUM RATINGS
Rating
Minimum Voltage (IN to GND)
Minimum Voltage (All others to GND)
Maximum Voltage (IN to GND)
Maximum Voltage (All others to GND)
Maximum Current from Vin to Vout (PMOS) (Note 1)
Symbol
Vmin in
Vmin
Vmax in
Vmax
Imax
Value
? 0.3
? 0.3
21
7.0
600
Unit
V
V
V
V
mA
Thermal Resistance, Junction ? to ? Air (Note 2)
Operating Ambient Temperature Range
Storage Temperature Range
Junction Operating Temperature
ESD Withstand Voltage (IEC 61000 ? 4 ? 2)
Human Body Model (HBM), Model = 2 (Note 3)
Machine Model (MM) Model = B (Note 4)
Moisture Sensitivity
TSOP ? 5
UDFN
R q JA
T A
T stg
T J
Vesd
MSL
305
260
? 40 to +85
? 65 to +150
150
15 Air, 8.0 Contact
2000
200
Level 1
° C/W
° C
° C
° C
kV
V
V
?
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. With minimum PCB area. By decreasing R q JA , the current capability increases. See PCB recommendation page 9.
2. R q JA is highly dependent on the PCB heat sink area (connected to PAD1, UDFN). See PCB Recommendations.
3. Human Body Model, 100 pF discharged through a 1.5 k W resistor following specification JESD22/A114.
4. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
5. Compliant with JEDEC Latch ? up Test, up to maximum voltage range.
http://onsemi.com
4
相关PDF资料 |
PDF描述 |
|---|---|
| 7010.9908.03 | FUSE 2A 125V FAST-ACT PCB SMD |
| RP1005S-1R2-F | RES HP 1.2 OHM 1/6W 1% 0402 SMD |
| 7010.9901.03 | FUSE 125MA 125V FAST-ACT PCB SMD |
| 7010.9902.03 | FUSE 250MA 125V FAST-ACT PCB SMD |
| LT1007CN8 | IC PREC OP-AMP HI-SPD SNGL 8-DIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NCP360MUTXG | 功能描述:监控电路 USB POS OVP PMOSFET AND STATUS FLAG RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| NCP360SNAET1G | 功能描述:监控电路 USB OVP SUPERVISORY RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| NCP360SNAFT1G | 功能描述:监控电路 USB OVP SUPERVISORY RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| NCP360SNAIT1G | 功能描述:监控电路 OVP SUPERVISORY OVLO RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| NCP360SNT1G | 功能描述:监控电路 USB OVP SUPERVISORY RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。