参数资料
型号: NCP4896EVB
厂商: ON Semiconductor
文件页数: 2/16页
文件大小: 0K
描述: EVAL BOARD FOR NCP4896
设计资源: NPC4896 Demo Brd BOM
NCP4896 Demo Brd Schematic
标准包装: 1
放大器类型: AB 类
输出类型: 1-通道(单声道)带单声道耳机
在某负载时最大输出功率 x 通道数量: 1.08W x 1 @ 8 欧姆; 176mW x 1 @ 16 欧姆
电源电压: 2.2 V ~ 5.5 V
板类型: 完全填充
已用 IC / 零件: NCP4896
已供物品:
其它名称: NCP4896EVBOS
NCP4896
http://onsemi.com
10
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 27. Power Dissipation vs. Output Power
0
0.2
0.7
0
0.1
P
D
,POWER
DISSIP
A
TION
(W)
Pout, OUTPUT POWER (W)
Figure 28. Power Dissipation vs. Output Power
0
0.1
0.2
0.3
0
0.1
P
D
,POWER
DISSIP
A
TION
(W)
Pout, OUTPUT POWER (W)
VP = 5 V
RL = 8 W
F = 1 kHz
THD + N < 0.1%
VP = 3.3 V
RL = 8 W
F = 1 kHz
THD + N < 0.1%
0.5
0.4
0.6
0.8
1
1.2
0.2
0.4
0.5
0.2
0.3
0.4
0.6
0.05
0.15
0.25
Figure 29. Power Dissipation vs. Output Power
0
0.1
0.2
0.3
0.4
0.25
0
0.05
P
D
,POWER
DISSIP
A
TION
(W)
Pout, OUTPUT POWER (W)
Figure 30. Power Dissipation vs. Output Power
0
0.05
0.1
0.15
0.4
0
0.1
P
D
,POWER
DISSIP
A
TION
(W)
Pout, OUTPUT POWER (W)
VP = 3 V
RL = 8 W
F = 1 kHz
THD + N < 0.1%
0.1
0.15
0.2
0.25
0.3
0.35
0.05
0.2
0.15
0.3
0.25
0.35
VP = 2.6 V
F = 1 kHz
THD + N < 0.1%
RL = 8 W
RL = 4 W
Figure 31. Power Derating 9Pin FlipChip CSP
0
20
160
700
0
P
D
,POWER
DISSIP
A
TION
(mW)
TA, AMBIENT TEMPERATURE (°C)
Figure 32. Maximum Die Temperature vs.
PCB Heatsink Area
50
100
250
180
40
60
DIE
TEMPERA
TURE
(
°C)
@
AMBIENT
TEMPERA
TURE
25
°C
PCB HEATSINK AREA (mm2)
120
150
200
100
200
300
400
500
600
80
100
160
140
PDmax = 633 mW
for VP = 5 V,
RL = 8 W
40
60
80
100
120
140
PCB Heatsink Area
500 mm2
50 mm2
200 mm2
300
Maximum Die Temperature 150
°C
VP = 2.6 V
VP = 5 V
VP = 3.3 V
VP = 4.2 V
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