参数资料
型号: NCP5208DR2G
厂商: ON Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: IC REG TERM DDR-I/II 1.7V 8SOIC
产品变化通告: Product Discontinuation 27/Jan/2012
标准包装: 1
应用: 控制器,DDR,DDR2
输入电压: 1.7 V ~ 5.5 V
输出数: 2
输出电压: 0.9 V,1.25V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 剪切带 (CT)
其它名称: NCP5208DR2GOSCT
NCP5208
DDR?I/II Termination
Regulator
The NCP5208 is a linear regulator specifically designed for the
active termination of DDR?I/II SDRAM. The device can be operated
from a single supply voltage as low as 1.7 V. For DDR?I
applications, the device is capable of sourcing and sinking current up
to 1.5 A with the output voltage regulated to within " 3% or better. A
separate voltage feedback pin ensures superior load regulation
against load and line changes.
http://onsemi.com
Protective features include soft?start, source/sink current limits
and thermal shutdown. Open?drain VTT OK output (POK) is added
for system monitoring. The shutdown pin can tri?state the regulator
output for Suspend To RAM (STR) state. This device is available in a
1
SOIC?8
D SUFFIX
CASE 751
SOIC?8 package.
Features
? Supports Both DDR?I and DDR?II SDRAM Requirements
? Single Supply Voltage Operation as Low as 1.7 V
? Integrated Power MOSFETs
? Few External Components Needed
? Source and Sink Current Up to 1.5 A
? Load Regulation Within " 3%
? Both Source and Sink Current Limits
? Open?Drain VTT OK (POK) Pin
? Shutdown Pin
? Thermal Shutdown
? Housed in SOIC?8 Package
? Pb?Free Package is Available
MARKING DIAGRAM
8
N5208
ALYW
G
1
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb?Free Package
PIN CONNECTIONS
Typical Applications
? DDR Termination Voltage
? Active Bus Termination (SSTL?2, SSTL?3)
POK 1
GND 2
VFB 3
8
7
6
VTT
PVIN
AVIN
2.5 V
VDDQ
VDDQ
SD
SD
4
(Top View)
5
VDDQ
AVIN
ORDERING INFORMATION
Device
Package
Shipping ?
NCP5208
POK
NCP5208DR2
SOIC?8
2500/Tape & Reel
2.5 V
C IN
AVIN
PVIN
VTT
VFB
VTT
1.25 V,
1.5 A
C OUT
NCP5208DR2G SOIC?8 2500/Tape & Reel
(Pb?Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
GND
Figure 1. Typical Application Circuit
? Semiconductor Components Industries, LLC, 2006
May, 2006 ? Rev. 5
1
Publication Order Number:
NCP5208/D
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