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参数资料
| 型号： | NCP5304PG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/16页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER HI/LOW SIDE HV 8-PDIP |
| 标准包装： | 50 |
| 配置： | 半桥 |
| 输入类型： | 非反相 |
| 延迟时间： | 100ns |
| 电流 - 峰： | 250mA |
| 配置数： | 1 |
| 输出数： | 2 |
| 高端电压 - 最大（自引导启动）： | 600V |
| 电源电压： | 10 V ~ 20 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
NCP5304
PIN DESCRIPTIONS
Pin No.
1
2
3
4
5
6
7
8
Pin Name
IN_LO
IN_HI
VCC
GND
DRV_LO
BRIDGE
DRV_HI
VBOOT
Pin Function
Logic Input for Low side driver output in phase
Logic Input for High side driver output in phase
Low side and main power supply
Ground
Low side gate drive output
Bootstrap return or High side floating supply return
High side gate drive output
Bootstrap power supply
MAXIMUM RATINGS
Rating
V CC
V CC_transient
V BRIDGE
V BRIDGE
V BOOT ? V BRIDGE
V DRV_HI
V DRV_LO
dV BRIDGE /dt
V IN_XX
Symbol
Main power supply voltage
Main transient power supply voltage:
IV CC_max = 5 mA during 10 ms
VHV: High Voltage BRIDGE pin
Allowable Negative Bridge Pin Voltage for IN_LO Signal Propagation to DRV_LO
(see characterization curves for detailed results)
VHV: Floating supply voltage
VHV: High side output voltage
Low side output voltage
Allowable output slew rate
Inputs IN_HI, IN_LO
ESD Capability:
? HBM model (all pins except pins 6 ? 7 ? 8 in 8 pins
package or 11 ? 12 ? 13 in 14 pins package)
? Machine model (all pins except pins 6 ? 7 ? 8 in 8 pins
package or 11 ? 12 ? 13 in 14 pins package)
Value
? 0.3 to 20
23
? 1 to 600
? 10
? 0.3 to 20
V BRIDGE ? 0.3 to
V BOOT + 0.3
? 0.3 to V CC + 0.3
50
? 1.0 to V CC + 0.3
2
200
Unit
V
V
V
V
V
V
V
V/ns
V
kV
V
Latch up capability per Jedec JESD78
R q JA
T J_max
Power dissipation and Thermal characteristics
PDIP ? 8: Thermal Resistance, Junction ? to ? Air
SO ? 8: Thermal Resistance, Junction ? to ? Air
Maximum Operating Junction Temperature
100
178
+150
° C/W
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
3
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