参数资料
型号: NCP571MN09TBGEVB
厂商: ON Semiconductor
文件页数: 8/11页
文件大小: 0K
描述: BOARD EVAL NCP571MN 0.9V
设计资源: NCP571MN09TBGEVB Bill of Materials
NCP571MN09TBGEVB Gerber Files
NCP571MN09TBGEVB Schematic
标准包装: 1
系列: *
NCP571, NCV571
V in
2.7 V
V in
NCP571
V out
V out
NC
C 1
GND
Enable
C 2
GND
0V
3.3 V
0.1 m F
0V
2.7 V
0.1 m F
GND
Enable
NL17SZ16
Figure 20.
R q JA
Hints
Please be sure the V in and GND lines are sufficiently wide.
When the impedance of these lines is high, there is a chance
to pick up noise or cause the regulator to malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Thermal
As power across the NCP571 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature effect the rate of temperature rise for the part.
This is stating that when the NCP571 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
The maximum dissipation the package can handle is given
by:
T J(max) * T A
P D +
If junction temperature is not allowed above the
maximum 125 ? C, then the NCP571 can dissipate up to
400 mW @ 25 ? C.
The power dissipated by the NCP571 can be calculated
from the following equation:
P tot + V in(max) I GND ) I out * V out * I out
If a 150 mA output current is needed then the ground
current from the data sheet is 4.0 m A.
http://onsemi.com
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