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| 型号： | NCV4276BDSADJR4G |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/18页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .4A D2PAK-5 |
| 标准包装： | 800 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 2.5 V ~ 20 V |
| 输入电压： | 4.5 V ~ 40 V |
| 电压 - 压降（标准）： | 0.25V @ 250mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 400mA |
| 电流 - 限制（最小）： | 400mA |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-6，D²Pak（5 引线+接片），TO-263BA |
| 供应商设备封装： | D2PAK-5 |
| 包装： | 带卷 (TR) |
NCV4276B
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
1
2
3
4
5
Symbol
I
INH
GND
NC/VA
Q
Description
Input; Battery Supply Input Voltage.
Inhibit; Set low-to inhibit.
Ground; Pin 3 internally connected to heatsink.
Not connected for fixed voltage version/Voltage Adjust Input for adjustable voltage version; use an external
voltage divider to set the output voltage
Output: Bypass with a capacitor to GND. See Figures 3 to 7 and Regulator Stability Considerations section.
Table 2. MAXIMUM RATINGS *
Input Voltage
Input Peak Transient Voltage
Inhibit INH Voltage
Voltage Adjust Input VA
Output Voltage
Ground Current
Input Voltage Operating Range
Rating
Symbol
V I
V I
V INH
V VA
V Q
I q
V I
Min
? 42
?
? 42
? 0.3
? 1.0
?
V Q + 0.5 V or 4.5 V
(Note 1)
Max
45
45
45
10
40
100
40
Unit
V
V
V
V
V
mA
V
ESD Susceptibility
Junction Temperature
Storage Temperature
(Human Body Model)
(Machine Model)
(Charged Device Model)
?
?
?
T J
T stg
4.0
250
1.25
? 40
? 50
?
?
?
150
150
kV
V
kV
? C
? C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal
dissipation must be observed closely.
1. Minimum V I = 4.5 V or (V Q + 0.5 V), whichever is higher.
Table 3. LEAD TEMPERATURE SOLDERING REFLOW (Note 2)
Lead Temperature Soldering
Reflow (SMD styles only), Leaded, 60 ? 150 s above 183, 30 s max at peak
Reflow (SMD styles only), Lead Free, 60 ? 150 s above 217, 40 s max at peak
Wave Solder (through hole styles only), 12 sec max
T SLD
?
?
?
240
265
310
? C
2. Per IPC/JEDEC J ? STD ? 020C.
Table 4. THERMAL CHARACTERISTICS (Notes 3 and 4)
Characteristic
DPAK 5-PIN PACKAGE
Test Conditions (Typical Value)
Min Pad Board (Note 5)
1 , Pad Board (Note 6)
Unit
Junction-to-Tab (psi-JLx, y JLx )
Junction-to-Ambient (R q JA , q JA )
D 2 PAK
5-PIN PACKAGE
Junction-to-Tab (psi-JLx, y JLx )
Junction-to-Ambient (R q JA , q JA )
4.2
100.9
0.4 sq. in. Spreader Board (Note 7)
3.8
74.8
4.7
46.8
1.2 sq. in. Spreader Board (Note 8)
4.0
41.6
C/W
C/W
C/W
C/W
3.
4.
5.
6.
7.
8.
Minimum V I = 4.5 V or (V Q + 0.5 V), whichever is higher.
Per IPC/JEDEC J ? STD ? 020C.
1 oz. copper, 0.26 inch 2 (168 mm 2 ) copper area, 0.062 ? thick FR4.
1 oz. copper, 1.14 inch 2 (736 mm 2 ) copper area, 0.062 ? thick FR4.
1 oz. copper, 0.373 inch 2 (241 mm 2 ) copper area, 0.062 ? thick FR4.
1 oz. copper, 1.222 inch 2 (788 mm 2 ) copper area, 0.062 ? thick FR4.
http://onsemi.com
3
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