参数资料
型号: NCV51411DR2G
厂商: ON Semiconductor
文件页数: 15/16页
文件大小: 0K
描述: IC REG BUCK 1.5A 8SOIC
标准包装: 1
类型: 降压(降压)
输出数: 1
输入电压: 4.5 V ~ 40 V
PWM 型: 混合物
频率 - 开关: 260kHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
包装: 剪切带 (CT)
供应商设备封装: 8-SOICN
其它名称: NCV51411DR2GOSCT
NCV51411
PACKAGE DIMENSIONS
SOIC 16 ? LEAD WIDE BODY EXPOSED PAD
PW SUFFIX
CASE 751AG
ISSUE A
A
? U ?
M
0.25 (0.010)
M
P
W M
16
1
9
8
B
? W ?
R x 45 _
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PIN 1 I.D.
G
TOP SIDE
14 PL
DETAIL E
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
MILLIMETERS
INCHES
0.10 (0.004) T
D 16 PL
K
C
? T ?
SEATING
PLANE
F
DIM
A
B
C
D
F
MIN MAX
10.15 10.45
7.40 7.60
2.35 2.65
0.35 0.49
0.50 0.90
MIN MAX
0.400 0.411
0.292 0.299
0.093 0.104
0.014 0.019
0.020 0.035
0.25 (0.010)
M
T U
S
W
S
J
G
H
1.27 BSC
3.45 3.66
0.050 BSC
0.136 0.144
H
DETAIL E
J
K
0.25 0.32
0.00 0.10
0.010 0.012
0.000 0.004
EXPOSED PAD
1
8
L
M
P
R
4.72 4.93
0 _ 7 _
10.05 10.55
0.25 0.75
0.186 0.194
0 _ 7 _
0.395 0.415
0.010 0.029
16              9
BACK SIDE
L
0.175
0.050
SOLDERING FOOTPRINT*
0.350
Exposed
Pad
CL
0.188
0.200
0.074
0.024
CL
0.150
0.376
DIMENSIONS: INCHES
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
15
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