参数资料
型号: NCV7708BDWR2G
厂商: ON Semiconductor
文件页数: 4/16页
文件大小: 0K
描述: IC DRIVER HALF BRIDGE HEX 28SOIC
标准包装: 1
类型: 高端/低端驱动器
输入类型: SPI
输出数: 12
导通状态电阻: 800 毫欧
电流 - 输出 / 通道: 500mA
电流 - 峰值输出: 3A
电源电压: 3 V ~ 5.5 V
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
供应商设备封装: 28-SOIC
包装: 标准包装
其它名称: NCV7708BDWR2GOSDKR
NCV7708B
MAXIMUM RATINGS
Rating
Value
Unit
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500 ms, Ivsx > ? 2 A
Output Pin OUTHx
(DC)
(AC – inductive clamping)
? 0.3 to 40
? 1.0
? 0.3 to 40
? 8.0
V
V
Output Pin OUTLx
(DC)
(AC), t < 500 ms, IOUTLx > ? 2 A
(AC Inductive Clamping)
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, V CC )
? 0.3 to 34
? 1.0
48
? 0.3 to 7.0
V
V
Output Current (OUTL1, OUTL2, OUTL3, OUTL4, OUTL5, OUTL6, OUTH1, OUTH2, OUTH3, OUTH4,
OUTH5, OUTH6)
(DC) Vds = 12 V
(DC) Vds = 20 V
(DC) Vds = 40 V
(AC) Vds = 12 V, (50 ms pulse, 1 s period)
(AC) Vds = 20 V, (50 ms pulse, 1 s period)
(AC) Vds = 40 V, (50 ms pulse, 1 s period)
? 1.5 to 1.5
? 0.7 to 0.7
? 0.25 to 0.25
? 2.0 to 2.0
? 0.9 to 0.9
? 0.3 to 0.3
A
Electrostatic Discharge, Human Body Model, VS1, VS2, OUTx
Electrostatic Discharge, Human Body Model, all other pins
Electrostatic Discharge, Machine Model
Electrostatic Discharge, Charged Device Model
Operating Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level
Peak Reflow Soldering Temperature: Pb ? Free, 60 to 150 seconds at 217 ° C (Note 1)
4.0
2.0
200
1.0
? 40 to 150
? 55 to 150
MSL 3
260
kV
kV
V
kV
° C
° C
?
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D.
RECOMMENDED OPERATING CONDITIONS
Value
Digital Supply Input Voltage (V CC )
Battery Supply Input Voltage (V S )
DC Output Current (D x , S x )
Junction Temperature (T J )
Rating
Min
3.0
5.1
?
? 40
Max
5.5
28
0.5
125
Unit
V
V
A
° C
THERMAL CONDITIONS
Test Conditions, Typical Value
Thermal Parameters
Junction ? to ? Lead (psi ? JL8, Y JL8 ) or Pins 6 ? 9, 20 ? 23
Junction ? to ? Ambient (R q JA , q JA )
mm 2
2. 1 ? oz copper, 240
copper area, 0.062 ″ thick FR4.
mm 2
copper area, 0.062 ″ thick FR4.
3. 1 ? oz copper, 986
min ? pad board (Note 2)
10
73
1 , ? pad board (Note 3)
11
56
Unit
° C/W
° C/W
http://onsemi.com
4
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