参数资料
型号: NCV87722DT33RKG
厂商: ON Semiconductor
文件页数: 3/17页
文件大小: 0K
描述: IC REG LDO 3.3V .35A DPAK-4
标准包装: 2,500
稳压器拓扑结构: 正,固定式
输出电压: 3.3V
输入电压: 4.5 V ~ 40 V
稳压器数量: 1
电流 - 输出: 350mA
电流 - 限制(最小): 400mA
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: TO-252-5,DPak(4 引线 + 接片),TO-252AD
供应商设备封装: D-Pak 5-引线
包装: 带卷 (TR)
NCV8772
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 1)
Input Current
Output Voltage (Note 2)
Output Current
Enable Input Voltage
Enable Input Current
DT (Reset Delay Time Select) Voltage
DT (Reset Delay Time Select) Current
Reset Output Voltage
Reset Output Current
Junction Temperature
Storage Temperature
DC
Transient, t < 100 ms
DC
Transient, t < 100 ms
V in
I in
V out
I out
V EN
I EN
V DT
I DT
V RO
I RO
T J
T STG
? 0.3
?
? 5
? 0.3
? 3
? 0.3
?
? 1
? 0.3
? 1
? 0.3
? 3
? 40
? 55
40
45
?
5.5
Current Limited
40
45
1
5.5
1
5.5
3
150
150
V
mA
V
mA
V
mA
V
mA
V
mA
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (V in + 0.3 V) (whichever is lower).
ESD CAPABILITY (Note 3)
Rating
ESD Capability, Human Body Model
ESD Capability, Machine Model
ESD Capability, Charged Device Model
Symbol
ESD HBM
ESD MM
ESD CDM
Min
? 2
? 200
? 1
Max
2
200
1
Unit
kV
V
kV
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC ? Q100 ? 002 (JS ? 001 ? 2010)
ESD Machine Model tested per AEC ? Q100 ? 003 (EIA/JESD22 ? A115)
ESD Charge Device Model tested per AEC ? Q100 ? 011 (EIA/JESD22 ? C101)
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
DPAK ? 5
D2PAK ? 5
D2PAK ? 7
MSL
1
1
3
?
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb ? Free Versions
T SLD
?
265 peak
° C
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS (Note 5)
Rating
Thermal Characteristics, DPAK ? 5
Thermal Resistance, Junction ? to ? Air (Note 6)
Thermal Reference, Junction ? to ? Case (Note 6)
Thermal Characteristics, D2PAK ? 5
Thermal Resistance, Junction ? to ? Air (Note 6)
Thermal Reference, Junction ? to ? Case (Note 6)
Thermal Characteristics, D2PAK ? 7
Thermal Resistance, Junction ? to ? Air (Note 6)
Thermal Reference, Junction ? to ? Case (Note 6)
Symbol
R q JA
R Y JC
R q JA
R Y JC
R q JA
R Y JC
Value
56
8.4
53
8.4
51
8.4
Unit
° C/W
° C/W
° C/W
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm 2 (or 1 in 2 ) of 1 oz copper thickness and FR4 PCB substrate.
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