参数资料
| 型号： | NL17SH08P5T5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/5页 |
| 文件大小： | 0K |
| 描述： | SINGLE 2-INPUT NAND GATE SOT953 |
| 标准包装： | 8,000 |
| 系列： | 17SH |
| 逻辑类型： | 与门 |
| 电路数： | 1 |
| 输入数： | 2 |
| 电源电压： | 2 V ~ 5.5 V |
| 电流 - 静态（最大值）： | 1µA |
| 输出电流高，低： | 8mA，8mA |
| 逻辑电平 - 低： | 0.5 V ~ 1.65 V |
| 逻辑电平 - 高： | 1.5 V ~ 3.85 V |
| 额定电压和最大 CL 时的最大传播延迟： | 7.9ns @ 4.5V ~ 5.5V，50pF |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | SOT-953 |
| 封装/外壳： | SOT-953 |
| 包装： | 带卷 (TR) |
NL17SH08
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
0.5 to +7.0
V
VIN
DC Input Voltage
0.5 to +7.0
V
VOUT
DC Output Voltage
0.5 to VCC +0.5
V
IIK
DC Input Diode Current
20
mA
IOK
DC Output Diode Current
±20
mA
IOUT
DC Output Sink Current
±25
mA
ICC
DC Supply Current per Supply Pin
50
mA
TSTG
Storage Temperature Range
65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
PD
Power Dissipation in Still Air
50
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
ILATCHUP Latchup Performance
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
55
+125
°C
tr , tf
Input Rise and Fall Time
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
0
100
20
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
10
100
1000
TIME, YEARS
NORMALIZED
F
AILURE
RA
TE
T J
=
80
C°
T J
=
90
C°
T J
=
100
C°
T J
=
1
10
C°
T J
=
130
C°
T J
=
120
C°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time
Junction Temperature
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