参数资料
型号: NL27WZ125USG
厂商: ON Semiconductor
文件页数: 5/5页
文件大小: 0K
描述: IC BUFFER DL TRI-ST NON-INV US8
标准包装: 1
系列: 27WZ
逻辑类型: 缓冲器/线路驱动器,非反相
元件数: 2
每个元件的位元数: 1
输出电流高,低: 32mA,32mA
电源电压: 1.65 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFSOP(0.091",2.30mm 宽)
供应商设备封装: US8
包装: 标准包装
产品目录页面: 1126 (CN2011-ZH PDF)
其它名称: NL27WZ125USGOSDKR
NL27WZ125
http://onsemi.com
5
PACKAGE DIMENSIONS
US8
CASE 49302
ISSUE B
DIM
A
MIN
MAX
MIN
MAX
INCHES
1.90
2.10
0.075
0.083
MILLIMETERS
B
2.20
2.40
0.087
0.094
C
0.60
0.90
0.024
0.035
D
0.17
0.25
0.007
0.010
F
0.20
0.35
0.008
0.014
G
0.50 BSC
0.020 BSC
H
0.40 REF
0.016 REF
J
0.10
0.18
0.004
0.007
K
0.00
0.10
0.000
0.004
L
3.00
3.20
0.118
0.126
M
0
6
0
6
N
5
10
5
10
P
0.23
0.34
0.010
0.013
R
0.23
0.33
0.009
0.013
S
0.37
0.47
0.015
0.019
U
0.60
0.80
0.024
0.031
V
0.12 BSC
0.005 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.140 MM (0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE INTER
LEAD FLASH OR PROTRUSION. INTERLEAD
FLASH AND PROTRUSION SHALL NOT E3XCEED
0.140 (0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.00760.0203 MM. (300800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
L
B
A
P
G
4
1
5
8
C
K
D
SEATING
J
S
R
U
DETAIL E
V
F
H
N
R 0.10 TYP
M
Y
X
T
DETAIL E
T
M
0.10 (0.004)
XY
T
0.10 (0.004)
__
PLANE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
mm
inches
SCALE 8:1
3.8
0.15
0.50
0.0197
1.0
0.0394
0.30
0.012
1.8
0.07
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NL27WZ125/D
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