参数资料
| 型号： | NLU2G17MUTCG |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/10页 |
| 文件大小： | 0K |
| 描述： | IC BUFF SCHM TRG DL N-INV 6UDFN |
| 标准包装： | 1 |
| 逻辑类型： | 施密特触发器 - 缓冲器，驱动器 |
| 元件数： | 2 |
| 每个元件的位元数： | 1 |
| 输出电流高，低： | 8mA，8mA |
| 电源电压： | 1.65 V ~ 5.5 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFDFN |
| 供应商设备封装： | 6-UDFN（1.2x1） |
| 包装： | 标准包装 |
| 产品目录页面： | 1126 (CN2011-ZH PDF) |
| 其它名称： | NLU2G17MUTCGOSDKR |
NLU2G17
http://onsemi.com
10
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
L
5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
3
4
6
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.15
0.25
D
1.45 BSC
E
1.00 BSC
e
0.50 BSC
L
0.25
0.35
L1
0.30
0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
5X
0.49
6X
1.24
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81358171050
NLU2G17/D
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| NLU2GU04MUTCG | 功能描述:变换器 HIGH SPEED CMOS DUAL UNBUFFERED INVERTER RoHS:否 制造商:NXP Semiconductors 电路数量:6 逻辑系列:74ABT 逻辑类型:BiCMOS 高电平输出电流:- 15 mA 低电平输出电流:20 mA 传播延迟时间:2.2 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 工作温度范围: 封装 / 箱体:DIP-14 封装:Tube |
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