参数资料
型号: NTD18N06LT4G
厂商: ON Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 60V 18A DPAK
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 18A
开态Rds(最大)@ Id, Vgs @ 25° C: 65 毫欧 @ 9A,5V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 22nC @ 5V
输入电容 (Ciss) @ Vds: 675pF @ 25V
功率 - 最大: 55W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: DPAK-3
包装: 标准包装
其它名称: NTD18N06LT4GOSDKR
NTD18N06L, NTDV18N06L
Power MOSFET
18 A, 60 V, Logic Level N ? Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
Features
? AEC Q101 Qualified ? NTDV18N06L
? These Devices are Pb ? Free and are RoHS Compliant
V (BR)DSS
60 V
R DS(on) TYP
54 m W@ 5.0 V
I D MAX
18 A
(Note 1)
Typical Applications
?
?
?
?
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
N ? Channel
D
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
Rating
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 10 M W )
Gate ? to ? Source Voltage
? Continuous
? Non ? repetitive (t p v 10 ms)
Symbol
V DSS
V DGR
V GS
V GS
Value
60
60
" 15
" 20
Unit
Vdc
Vdc
Vdc
S
MARKING
DIAGRAMS
4
Drain
1
3
Gate
Source
3
Drain Current
? Continuous @ T A = 25 ° C I D 18 Adc
? Continuous @ T A = 100 ° C I D 10
? Single Pulse (t p v 10 m s) I DM 54 Apk
Total Power Dissipation @ T A = 25 ° C P D 55 W
Derate above 25 ° C 0.36 W/ ° C
Total Power Dissipation @ T A = 25 ° C (Note 2) 2.1 W
Operating and Storage Temperature Range T J , T stg ? 55 to ° C
+175
Single Pulse Drain ? to ? Source Avalanche E AS 72 mJ
Energy ? Starting T J = 25 ° C
(V DD = 50 Vdc, V GS = 5.0 Vdc,
L = 1.0 mH, I L (pk) = 12 A, V DS = 60 Vdc)
Thermal Resistance ° C/W
? Junction ? to ? Case R q JC 2.73
? Junction ? to ? Ambient (Note 1) R q JA 100
? Junction ? to ? Ambient (Note 2) R q JA 71.4
Maximum Lead Temperature for Soldering T L 260 ° C
Purposes, 1/8 ″ from case for 10 seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommen-
ded Operating Conditions is not implied. Extended exposure to stresses above
the Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR ? 4 board using the minimum recommended
pad size.
2. When surface mounted to an FR ? 4 board using the 0.5 sq in drain pad size.
4
DPAK
CASE 369C
1 2 STYLE 2
3
2
Drain
4
Drain
4
DPAK ? 3
CASE 369D
STYLE 2
1
2
1 2 3
Gate Drain Source
18N6L = Device Code
Y = Year
WW = Work Week
G = Pb ? Free Device
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
August, 2011 ? Rev. 6
1
Publication Order Number:
NTD18N06L/D
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