参数资料
型号: NTD4804N-35G
厂商: ON Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 30V 14.5A IPAK
产品变化通告: Reactivation Notice 23/Dec/2010
Product Obsolescence 07/Jul/2010
Product Discontinuation 30/Sept/2011
标准包装: 75
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 14.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 4 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 40nC @ 4.5V
输入电容 (Ciss) @ Vds: 4490pF @ 12V
功率 - 最大: 1.43W
安装类型: 通孔
封装/外壳: TO-251-3 短截引线,IPak
供应商设备封装: I-Pak
包装: 管件
其它名称: NTD4804N-35G-ND
NTD4804N-35GOS
NTD4804N, NVD4804N
Power MOSFET
30 V, 117 A, Single N ? Channel, DPAK/IPAK
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? AEC Q101 Qualified ? NVD4804N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
4.0 m W @ 10 V
5.5 m W @ 4.5 V
D
I D MAX
117 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter Symbol
Drain ? to ? Source Voltage
V DSS
Value
30
Unit
V
G
N ? Channel
Gate ? to ? Source Voltage
V GS
" 20
V
S
Power Dissipation
1 2
3
3
4
Drain
Continuous Drain
Current (R q JA ) (Note 1)
Power Dissipation
(R q JA ) (Note 1)
Continuous Drain
Current (R q JA ) (Note 2)
Steady
State
(R q JA ) (Note 2)
Continuous Drain
Current (R q JC )
(Note 1)
Power Dissipation
(R q JC ) (Note 1)
Pulsed Drain Current    t p =10 m s
Current Limited by Package
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
T A = 25 ° C
T A = 25 ° C
I D
P D
I D
P D
I D
P D
I DM
I DmaxPkg
19.6
15.2
2.66
14.5
11
1.43
124
96
107
230
45
A
W
A
W
A
W
A
A
4
4
1
2
CASE 369AA CASE 369AD CASE 369D
DPAK 3 IPAK IPAK
(Bent Lead) (Straight Lead) (Straight Lead
STYLE 2 DPAK)
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
4 Drain
Drain
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T stg
I S
? 55 to
175
78
° C
A
1
2
3
Drain to Source dV/dt
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 24 V, V GS = 10 V,
L = 1.0 mH, I L(pk) = 30 A, R G = 25 W )
dV/dt
E AS
6.0
450
V/ns
mJ
2
1 Drain 3 1 2 3
Gate Source Gate Drain Source
Gate Drain Source
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
Y
WW
= Year
= Work Week
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
4804N = Device Code
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
August, 2011 ? Rev. 8
1
Publication Order Number:
NTD4804N/D
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