参数资料
型号: NTD4805NT4G
厂商: ON Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 30V 12.7A DPAK
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 12.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 5 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 26nC @ 4.5V
输入电容 (Ciss) @ Vds: 2865pf @ 12V
功率 - 最大: 1.41W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
其它名称: NTD4805NT4G-ND
NTD4805NT4GOSTR
NTD4805N, NVD4805N
Power MOSFET
30 V, 88 A, Single N ? Channel, DPAK/IPAK
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? AEC ? Q101 Qualified and PPAP Capable ? NVD4805N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
5.0 m W @ 10 V
7.4 m W @ 4.5 V
D
I D MAX
88 A
MAXIMUM RATINGS (T J = 25 ? C unless otherwise noted)
Parameter Symbol
Drain ? to ? Source Voltage
V DSS
Value
30
Unit
V
G
N ? Channel
Gate ? to ? Source Voltage
V GS
? 20
V
S
Power Dissipation
1 2
3
3
4
Continuous Drain
Current (R q JA ) (Note 1)
Power Dissipation
(R q JA ) (Note 1)
Continuous Drain
Current (R q JA ) (Note 2)
Steady
State
(R q JA ) (Note 2)
Continuous Drain
Current (R q JC )
(Note 1)
Power Dissipation
(R q JC ) (Note 1)
Pulsed Drain Current    t p =10 m s
Current Limited by Package
T A = 25 ? C
T A = 85 ? C
T A = 25 ? C
T A = 25 ? C
T A = 85 ? C
T A = 25 ? C
T C = 25 ? C
T C = 85 ? C
T C = 25 ? C
T A = 25 ? C
T A = 25 ? C
I D
P D
I D
P D
I D
P D
I DM
I DmaxPkg
17.4
13.5
2.65
12.7
9.8
1.41
95
73
79
175
45
A
W
A
W
A
W
A
A
4
4
1
2
CASE 369AA CASE 369D
DPAK IPAK
(Bent Lead) (Straight Lead
STYLE 2 DPAK)
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
Drain
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T stg
I S
? 55 to
175
55
? C
A
1
2
3
Source Current (Body Diode) Pulsed t p =20 m s I SM 175 A
Drain to Source dV/dt dV/dt 6.0 V/ns
Single Pulse Drain ? to ? Source Avalanche E AS 288 mJ
Energy (V DD = 24 V, V GS = 10 V,
L = 1.0 mH, I L(pk) = 24 A, R G = 25 W )
Lead Temperature for Soldering Purposes T L 260 ? C
(1/8 ? from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
1 Drain 3
Gate Source
Gate Drain Source
Y = Year
WW = Work Week
4805N = Device Code
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2013
March, 2013 ? Rev. 7
1
Publication Order Number:
NTD4805N/D
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