参数资料
型号: NTHD3100CT1G
厂商: ON Semiconductor
文件页数: 7/8页
文件大小: 0K
描述: MOSFET N+P 20V 2.9A CHIPFET
产品目录绘图: MOSFET ChipFET
标准包装: 10
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.9A,3.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 80 毫欧 @ 2.9A,4.5V
Id 时的 Vgs(th)(最大): 1.2V @ 250µA
闸电荷(Qg) @ Vgs: 2.3nC @ 4.5V
输入电容 (Ciss) @ Vds: 165pF @ 10V
功率 - 最大: 1.1W
安装类型: 表面贴装
封装/外壳: 8-SMD,扁平引线
供应商设备封装: ChipFET?
包装: 标准包装
产品目录页面: 1558 (CN2011-ZH PDF)
其它名称: NTHD3100CT1GOSDKR
NTHD3100C
TYPICAL P ? CHANNEL PERFORMANCE CURVES
(T J = 25 ° C unless otherwise noted)
1500
1200
C iss
V GS = 0 V
T J = 25 ° C
5
4 ? V DS
QT
? V GS
10
8
900
3
6
600
V DS = 0 V
C rss
2
Q gs
Q gd
4
300
0
5
? V GS
0
? V DS
5
10
C oss
15
20
1
0
0
2
I D = ? 3.2 A
T J = 25 ° C
4 6
Q g , TOTAL GATE CHARGE (nC)
8
2
0
GATE ? TO ? SOURCE OR DRAIN ? TO ? SOURCE VOLTAGE (VOLTS)
Figure 17. Capacitance Variation
Figure 18. Gate ? to ? Source and
Drain ? to ? Source Voltage vs. Total Charge
1000
100
V DS = ? 10 V
I D = ? 3.2 A
V GS = ? 4.5 V
t d(off)
t f
5
4
3
V GS = 0 V
T J = 25 ° C
t r
10
t d(on)
2
1
1
1
10
100
0
0.3
0.6
0.9
1.2
R G , GATE RESISTANCE (OHMS)
Figure 19. Resistive Switching Time Variation
vs. Gate Resistance
DEVICE ORDERING INFORMATION
? V SD , SOURCE ? TO ? DRAIN VOLTAGE (VOLTS)
Figure 20. Diode Forward Voltage vs. Current
Device
NTHD3100CT1
NTHD3100CT1G
NTHD3100CT3
NTHD3100CT3G
Package
ChipFET
ChipFET
(Pb ? Free)
ChipFET
ChipFET
(Pb ? Free)
Shipping ?
3000 / Tape & Reel
3000 / Tape & Reel
10000 / Tape & Reel
10000 / Tape & Reel
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
7
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