参数资料
型号: NTLJD3182FZTAG
厂商: ON Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 20V 2.2A 6-WDFN
产品变化通告: Product Obsolescence 21/Jan/2010
标准包装: 3,000
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 二极管(隔离式)
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 100 毫欧 @ 2A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 7.8nC @ 4.5V
输入电容 (Ciss) @ Vds: 450pF @ 10V
功率 - 最大: 710mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-WDFN(2x2)
包装: 带卷 (TR)
NTLJD3182FZ
Power MOSFET and
Schottky Diode
? 20 V, ? 4.0 A, m Cool t Single P ? Channel
& Schottky Barrier Diode, ESD
Features
? WDFN 2x2 mm Package with Exposed Drain Pads for Excellent
Thermal Conduction
? Lowest R DS(on) Solution in 2x2 mm Package
? Footprint Same as SC ? 88 Package
? Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
? ESD Protected
? High Current Schottky Diode: 2 A Current Rating
? This is a Pb ? Free Device
Applications
? Optimized for Battery and Load Management Applications in
Portable Equipment
? Li ? Ion Battery Charging and Protection Circuits
? DC ? DC Buck Circuit
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
? 20 V
V R Max
20 V
http://onsemi.com
P ? CHANNEL MOSFET
R DS(on) Max
100 m W @ ? 4.5 V
144 m W @ ? 2.5 V
200 m W @ ? 1.8 V
SCHOTTKY DIODE
V F Max
0.47 V
S A
I D Max
? 4.0 A
I F Max
2.0 A
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
? 20
± 8.0
V
V
G
Continuous Drain
Current (Note 1)
Steady
State
t ≤ 5s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
? 3.2
? 2.3
? 4.0
A
D
K
MARKING
K
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
t ≤ 5s
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
P D
I D
P D
1.5
2.3
? 2.2
? 1.6
0.71
W
A
W
P ? CHANNEL MOSFET SCHOTTKY DIODE
D
WDFN6 1 6
Pin 1
DIAGRAM
CASE 506AN 2 JJM G 5
3 G 4
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I DM
T J , T STG
I S
T L
? 16
? 55 to
150
? 1.0
260
A
° C
A
° C
JJ = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
SCHOTTKY MAXIMUM RATINGS (T J = 2 5 ° C unless otherwise stated)
Parameter Symbol Value Unit
A
1
K
6
K
Peak Repetitive Reverse Voltage
DC Blocking Voltage
V RRM
V R
30
30
V
V
N/C
2
D
5
G
Average Rectified Forward Current I F 2.0 A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
D
3
(Top View)
4
S
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size,
(30 mm 2 , 2 oz Cu).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
? Semiconductor Components Industries, LLC, 2008
December, 2008 ? Rev. 0
1
Publication Order Number:
NTLJD3180PZ/D
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