参数资料
型号: NTMFS4922NET1G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 30V 147A SO8-FL
标准包装: 1,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 17.1A
开态Rds(最大)@ Id, Vgs @ 25° C: 2 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 34nC @ 4.5V
输入电容 (Ciss) @ Vds: 5505pF @ 15V
功率 - 最大: 930mW
安装类型: 表面贴装
封装/外壳: 8-TDFN 裸露焊盘(5 引线)
供应商设备封装: 6-DFN,8-SO 扁平引线(5x6)
包装: 带卷 (TR)
NTMFS4922NE
Power MOSFET
30 V, 147 A, Single N ? Channel, SO ? 8 FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? Dual Sided Cooling Capability
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? CPU Power Delivery, DC ? DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(ON) MAX
2.0 m W @ 10 V
3.0 m W @ 4.5 V
D (5,6)
I D MAX
147 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
V GS
± 20
V
G (4)
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
T A = 25 ° C
T A = 100 ° C
I D
P D
I D
29.1
18.4
2.72
47.5
30.0
A
W
A
S (1,2,3)
N ? CHANNEL MOSFET
MARKING
DIAGRAM
S
AYWZZ
S
G
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
T C = 25 ° C
T C =100 ° C
T C = 25 ° C
P D
I D
P D
I D
P D
7.23
17.1
10.8
0.93
147
93
69.44
W
A
W
A
W
1 S
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
A = Assembly Location
Y = Year
W = Work Week
ZZ
= Lot Traceability
D
4922NE
D
D
D
Pulsed Drain Current
T A = 25 ° C, t p = 10 m s
I DM
442
A
Current Limited by Package T A = 25 ° C
Operating Junction and Storage Temperature
I Dmax
T J ,
T STG
100
? 55 to
+150
A
° C
ORDERING INFORMATION
Device Package Shipping ?
Source Current (Body Diode)
Drain to Source DV/DT
I S
dV/d t
68
6
A
V/ns
NTMFS4922NET1G
SO ? 8 FL
(Pb ? Free)
1500 /
Tape & Reel
Single Pulse Drain ? to ? Source Avalanche
Energy T J = 25 ° C, V DD = 24 V, V GS = 10 V,
I L = 37 A pk , L = 0.3 mH, R G = 25 W
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
E AS
T L
162.5
260
mJ
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 1
1
Publication Order Number:
NTMFS4922NE/D
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