参数资料
型号: NTMS4816NR2G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH 30V 6.8A 8-SOIC
产品变化通告: Wire Change 29/Aug/2008
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6.8A
开态Rds(最大)@ Id, Vgs @ 25° C: 10 毫欧 @ 9A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 18.3nC @ 10V
输入电容 (Ciss) @ Vds: 1060pF @ 25V
功率 - 最大: 780mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 标准包装
其它名称: NTMS4816NR2GOSDKR
NTMS4816N
Power MOSFET
30 V, 11 A, N ? Channel, SO ? 8
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These Devices are Pb ? Free and are RoHS Compliant
http://onsemi.com
Applications
? Disk Drives
? DC ? DC Converters
? Printers
V (BR)DSS
30 V
R DS(ON) MAX
10 m W @ 10 V
16 m W @ 4.5 V
I D MAX
11 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol
Value
Unit
N ? Channel
D
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
± 20
V
V
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JA (Note 2)
Steady
State
Steady
State
Steady
State
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
I D
P D
I D
9.0
7.2
1.37
6.8
5.4
A
W
A
G
S
MARKING DIAGRAM/
PIN ASSIGNMENT
Source
Source
Source
Gate
Top View
Power Dissipation R q JA
(Note 2)
Continuous Drain
Current R q JA , t v 10 s
(Note 1)
Power Dissipation
R q JA , t v 10 s(Note 1)
Pulsed Drain Current
T A = 25 ° C
Steady T A = 25 ° C
State
T A = 70 ° C
Steady T A = 25 ° C
State
T A = 25 ° C, t p = 10 m s
P D
I D
P D
I DM
0.78
11
8.8
2.04
33
W
A
W
A
1
1
SO ? 8
CASE 751
STYLE 12
4816N = Device Code
A = Assembly Location
8
Drain
Drain
Drain
Drain
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 12.5 A pk , L = 1.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J ,
T stg
I S
E AS
T L
? 55 to
150
2.7
78
260
° C
A
mJ
° C
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol
Junction ? to ? Ambient – Steady State (Note 1) R q JA
Junction ? to ? Ambient – t v 10 s (Note 1) R q JA
Junction ? to ? Foot (Drain) R q JF
Junction ? to ? Ambient – Steady State (Note 2)
R q JA
Value
91.5
61.3
22.5
159.5
Unit
° C/W
NTMS4816NR2G SO ? 8 2500 / Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surfacemounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2013
September, 2013 ? Rev. 2
1
Publication Order Number:
NTMS4816N/D
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