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参数资料
| 型号： | NUD4011 |
| 厂商： | ON SEMICONDUCTOR |
| 英文描述： | Low Current LED Driver(低电流LED驱动器) |
| 中文描述： | 低电流LED驱动器（低电流的LED驱动器） |
| 文件页数： | 8/9页 |
| 文件大小： | 133K |
| 代理商： | NUD4011 |
NUD4011
http://onsemi.com
8
THERMAL INFORMATION
NUD4011 Power Dissipation
The power dissipation of the SO
8 is a function of the pad
size. This can vary from the minimum pad size for soldering
to a pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
T
J(max)
, the maximum rated junction temperature of the die,
R
JA
, the thermal resistance from the device junction to
ambient, and the operating temperature, T
A
. Using the
values provided on the data sheet for the SO
8 package, P
D
can be calculated as follows:
PD
TJmax
TA
RJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T
A
of 25
°
C, one can
calculate the power dissipation of the device which in this
case is 1.13 W.
PD
150
°
C
25
°
C
110
°
C
1.13 W
The 110
°
C/W for the SO
8 package assumes the use of a
FR
4 copper board with an area of 2 square inches with 2 oz
coverage to achieve a power dissipation of 1.13 W. There are
other alternatives to achieving higher dissipation from the
SOIC package. One of them is to increase the copper area to
reduce the thermal resistance. Figure 11 shows how the
thermal resistance changes for different copper areas.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad
. Using a
board material such as Thermal Clad or an aluminum core
board, the power dissipation can be even doubled using the
same footprint.
60
80
100
120
140
160
180
0
1
2
3
4
5
6
7
8
9
10
BOARD AREA (in
2
)
J
°
C
Figure 11. JA versus Board Area
0
50
100
150
200
250
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
R
°
/
TIME (sec)
1S
36.9 sq. mm
0.057 in sq.
1S
75.8 sq. mm
0.117 in sq.
1S
150.0 sq. mm
0.233 in sq.
1S
321.5 sq. mm
0.498 in sq.
1S
681.0 sq. mm
1.056 in sq.
1S
1255.0 sq. mm
1.945 in sq.
Figure 12. Transient Thermal Response
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NUD4011/D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Low Current LED Driver |
| NUD4011DR2 | 功能描述:LED照明驱动器 Low Current LED RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| NUD4011DR2G | 功能描述:LED照明驱动器 MI LO CUR LED DRVR RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| NUD4011DR2G-CUT TAPE | 制造商:ON 功能描述:NUD4011 Series 70 mA 200 V Surface Mount Low Current LED Driver - SOIC-8 |
| NUD4301 | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Dual Channel LED Driver/Current Source |
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