参数资料
型号: NUF2222FCT1G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: IC FILTER 2CH EMI USB FLIPCHIP
产品变化通告: 1Q2012 Discontinuation 30/Mar/2012
标准包装: 1
类型: 低通
技术: RC(Pi)
通道数: 2
中心 / 截止频率: 190MHz(截止值)
衰减值: 20dB @ 900MHz ~ 3GHz
电阻 - 通道 (Ohms): 33
值: R = 33 欧姆,C = 36pF
ESD 保护:
滤波器阶数: 2nd
应用: USB
封装/外壳: 8-WFBGA,FCBGA
尺寸/尺寸: 0.050" L x 0.078" W(1.27mm x 1.97mm)
高度: 0.028"(0.70mm)
包装: 剪切带 (CT)
工作温度: -40°C ~ 85°C
其它名称: NUF2222FCT1GOSCT
NUF2222FC
2 Line USB 1.1 Upstream
EMI Filter
This device is a 2 line EMI filter array for USB port protection in
wireless applications. Greater than ?20 dB attenuation is obtained at
frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated
ESD protection. ESD protection is provided across all capacitors.
http://onsemi.com
Features
? EMI Filtering and ESD Protection
? Integration of 10 Discretes
? Provides Protection for IEC61000?4?2 (Level 4)
A1
C1
1.3 K
33 R
A3
C3
?
?
?
? 15 kV (Contact)
Flip?Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
B2
D2
(Gnd Pin)
1
FC SUFFIX
Benefits
? Reduces EMI/RFI Emissions on a Data Line
? Integrated Solution Offers Cost and Space Savings
? Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
? Integrated Solution Improves System Reliability
? This is a Pb?Free Device
Applications
? EMI Filtering and ESD Protection for Data Lines
? Cell Phones
? Handheld Products
? Notebook Computers
? MP3 Players
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
33 R
E1
MARKING
DIAGRAM
1
Flip?Chip
2222AYWW
CASE 499AM
2222 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
PIN CONFIGURATION
E3
Rating
Symbol
Value
Unit
3
2 1
ESD Discharge
Contact Discharge
V PP
15
kV
A
IEC61000?4?2
B
Operating Temperature Range
Storage Temperature Range
Junction Temperature
T OP
T STG
T J
?40 to +85
?55 to +150
+125
° C
° C
° C
C
D
E
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ORDERING INFORMATION
*For additional information on our Pb?Free strategy and soldering details, please
Device
Package
Shipping ?
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
NUF2222FCT1G
Flip?Chip
3000 Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2005
June, 2005 ? Rev. 0
1
Publication Order Number:
NUF2222FC/D
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