参数资料
型号: NUF2441FCT1
厂商: ON Semiconductor
文件页数: 1/3页
文件大小: 0K
描述: IC FILTER AUDIO 6-PIN FLIPCHIP
标准包装: 3,000
类型: 低通
技术: LC(Pi)
通道数: 2
电阻 - 通道 (Ohms): 0.28
值: L = 2.9nH,C = 250pF
ESD 保护:
滤波器阶数: 3rd
应用: 扬声电话
封装/外壳: 6-WFBGA,FCBGA
尺寸/尺寸: 0.067" L x 0.048" W(1.72mm x 1.22mm)
高度: 0.028"(0.70mm)
包装: 带卷 (TR)
工作温度: -40°C ~ 125°C
NUF2441FC
Integrated Passive Filter
with ESD Protection
This device is designed for cell phone applications requiring
Headset and Speaker Phone , EMI Filtering and ESD Protection .
This device offers an integrated solution in a small package reducing
PCB space and cost.
Features:
http://onsemi.com
CIRCUIT DESCRIPTION
? Provides EMI Filtering and ESD Protection
? Single IC Offers Cost Savings by Replacing 2 Inductors,
4 Capacitors, and 4 TVs Diodes
? Compliance with IEC61000--4--2, (Level 4)
30 kV (Contact), 30 kV (air)
? Flip--Chip Package
? Moisture Sensitivity Level 1
B1
A1
C 1
C 1
L
L
B2
C 2
C 2
B3
A3
?
?
ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
Pb--Free Package is Available*
A2
MARKING
Benefits:
DIAGRAM
? Flip--Chip Package Minimizes PCB Space
? Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
? TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
A1
Flip--Chip
CASE 499J
2441
A
Y
WW
2441AYWW
= Specific Device Code
= Assembly Location
= Year
= Work Week
? Cell Phones
? Communication Circuits
PIN CONFIGURATION
MAXIMUM RATINGS (T A = 25 ? C)
A1
B1
Rating
ESD Discharge IEC61000--4--2
Contact Discharge
Air Discharge
Symbol
V pp
Value
30
30
Unit
kV
A2
A3
B2
B3
Operating Temperature Range
Storage Temperature Range
T J
T stg
--40 to +125
--55 to +150
? C
? C
(Bump View)
Lead Solder Temperature T L 260 ? C
(10 second duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb--Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Package Device Shipping ?
NUF2441FCT1 Flip--Chip 3000/Tape & Reel
NUF2441FCT1G Flip--Chip 3000/Tape & Reel
(Pb--Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2010
November, 2010 -- Rev. 5
1
Publication Order Number:
NUF2441FC/D
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