参数资料
型号: NUP4114UPXV6T1G
厂商: ON Semiconductor
文件页数: 7/9页
文件大小: 0K
描述: TVS ARRAY QUAD UNIDIR SOT-563
产品变化通告: Wire Bond Change 01/Dec/2010
标准包装: 4,000
电压 - 反向隔离(标准值): 5V
电压 - 击穿: 6V
电极标记: 4 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: SOT-563,SOT-666
供应商设备封装: SOT-563
包装: 带卷 (TR)
NUP4114 Series, SZNUP4114HMR6T1G
PACKAGE DIMENSIONS
TSOP ? 6
CASE 318G ? 02
ISSUE U
C
E1
NOTE 5
0.05
A1
e
6
1
5
2
D
4
3
E
b
A
c
H
L
M
DETAIL Z
DETAIL Z
L2
GAUGE
PLANE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
E1 1.30 1.50 1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
L2 0.25 BSC
M 0 ° ? 1 0 °
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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