参数资料
型号: NVTFS5826NLTAG
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 60V 20A 8WDFN
标准包装: 1,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 7.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 24 毫欧 @ 10A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 16nC @ 10V
输入电容 (Ciss) @ Vds: 850pF @ 25V
功率 - 最大: 3.2W
安装类型: 表面贴装
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WDFN(3.3x3.3)
包装: 带卷 (TR)
NVTFS5826NL
Power MOSFET
60 V, 24 m W , 20 A, Single N ? Channel
Features
? Small Footprint (3.3 x 3.3 mm) for Compact Design
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? NVTFS5826NLWF ? Wettable Flanks Product
? AEC ? Q101 Qualified and PPAP Capable
? These Devices are Pb ? Free and are RoHS Compliant
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
60 V
http://onsemi.com
R DS(on) MAX
24 m W @ 10 V
32 m W @ 4.5 V
I D MAX
20 A
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Symbol
V DSS
V GS
Value
60
± 20
Unit
V
V
N ? Channel
D (5 ? 8)
Continuous Drain Cur-
rent R Y J ? mb (Notes 1,
2, 3, 4)
Power Dissipation
R Y J ? mb (Notes 1, 2, 3)
Steady
State
T mb = 25 ° C
T mb = 100 ° C
T mb = 25 ° C
T mb = 100 ° C
I D
P D
20
14
22
11
A
W
G (4)
S (1, 2, 3)
T A = 100 ° C
T A = 25 ° C
Continuous Drain Cur-
rent R q JA (Notes 1 &
3, 4)
Power Dissipation
R q JA (Notes 1, 3)
Pulsed Drain Current
T A = 25 ° C
Steady
State
T A = 100 ° C
T A = 25 ° C, t p = 10 m s
I D
P D
I DM
7.6
5.4
3.2
1.6
127
A
W
A
1
WDFN8
( m 8FL)
CASE 511AB
MARKING DIAGRAM
1
S D
S XXXX D
S AYWW G D
G G D
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T stg
I S
? 55 to
+175
18
° C
A
XXXX
A
Y
= Specific Device Code
= Assembly Location
= Year
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 24 V, V GS = 10 V,
I L(pk) = 20 A, L = 0.1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
E AS
T L
20
260
mJ
° C
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Parameter
Junction ? to ? Mounting Board (top) ? Steady
State (Note 2 and 3)
Junction ? to ? Ambient ? Steady State (Note 3)
Symbol
R Y J ? mb
R q JA
Value
6.8
47
Unit
° C/W
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi ( Y ) is used as required per JESD51 ? 12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface ? mounted on FR4 board using a 650 mm 2 , 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
? Semiconductor Components Industries, LLC, 2013
May, 2013 ? Rev. 2
1
Publication Order Number:
NVTFS5826NL/D
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