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参数资料
| 型号： | OH300-61003CV-020.0M |
| 厂商： | Connor-Winfield |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | OSC OCVCXO 20.000 MHZ 3.3V |
| 标准包装： | 1 |
| 系列： | OH300 |
| 类型： | OCVCXO |
| 频率： | 20MHz |
| 输出： | CMOS |
| 电源电压： | 3.3V |
| 频率稳定性： | ±10ppb |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | CW751DKR |
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
Environmental Characteristics
Shock 500 G’s 1ms, Halfsine, 3 shocks per direction, per MIL-STD 202G, Method 213B Test Condition D.
Sinusoidal Vibration 0.06” D.A. or 10G’s Peak, 10 to 500 Hz, per MIL-STD-202G, Method 204D, Test Condition A.
Random Vibration 5.35 G’s rms. 20 to 2000 Hz per MIL-STD-202G, Method 214,Test Condition 1A, 15 minutes each axis.
Moisture 10 cycles, 95% RH, Per MIL-STD-202G, Method 112.
Marking Permanency Per MIL-STD-202G, Method 215J.
Solder Process Recommendations: RoHS compliant, lead free. See solder profile on page 6.
In-line reflow: Refer to recommended reflow pre-heat and reflow temperatures on page 6. Package material
consist of Ryton R-4 high temperature cover with FR4 substrate. Component solder is Pb free high
temperature eutectic alloy with a melting point of 221°C.|
In-line oven profile: We recommend using KIC profiler or similar device placing one of the thermocouples on the
device to insure that the internal package temperature does not exceed 221°C.
Removal of device : If for any reason the device needs to be removed from the board, use a temperature controlled
repair station with profile monitoring capabilities. Following a monitored profile will insure the
device is properly pre-heated prior to relow. Refer to IPC 610E for inspection guidelines.
Recommended Cleaning Process: (If required)
Device is non-hermetic, water resistance with four weep holes, one in each corner to allow
moisture to be removed during the drying cycle. We recommend in-line warm water wash
with air knife and drying capabilities. If cleaner does not have drying capability, then use hot air
circulated oven. Boards should be placed in the oven vertically for good water runoff
Device must be dried properly prior to use!
Note: If saponifier is used make sure the device is rinsed properly to insure all residues are removed. PH of saponifier should
not exceed 10.
Drying Temperature: Between 85 to 100°C.
Drying Time: Time will vary depending on the board size.
Caution: Do not submerge the device!
Package Outline
Suggested Pad Layout
0.866+/-0.008
(22.00+/-0.20mm)
0.300
(7.62mm)
0.200
(5.08mm)
0.200
(5.08mm)
0.300
(7.62mm)
0.150
(3.81mm)
0.200
(5.08mm)
0.125
(3.175mm) Typ.
I ( W
1238
0.120 Typ.
OH300-61003CF
38.88 MHZ
1.000+/-0.008
(3.048mm)
0123456789012
(25.40+/-0.20mm)
(Bottom View)
(Top View)
0.905
0123456789012
(22.99mm)
Pin 1
0.062
0.350
(8.89mm)
0.500
0.700
(17.78mm)
Typical Pad Size
0.100 x 0.100
(2.54 x 2.54mm)
7 Places
0.350
(8.89mm)
0.350
(8.89mm)
Keep Out
Area
(1.57mm) (12.70mm) Max.
Dimensional Tolerance
+/-0.005 (0.127mm)
* Do not route any traces in the keep out area. It is recommended
the next layer under the keep out area is to be ground plane.
Pad Termination Finish: Gold Flash <10 micro inches
Marking Information
Pad Connections
I ( W 1238
OH300-61003CF
38.88 MHZ
0123456789012
Date Code (YYWW)
Model Number
Output Frequency
Serial # Barcode
1:
2:
3:
4:
5:
6:
7:
Voltage Control or N/C
N/C
Supply Voltage (Vcc)
RF Output
Do Not Connect
Do Not Connect
Ground (Case)
0123456789012
Serial Number
DO NOT connect "DNC" pads to ground
or supply rails.
Pin 1
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. Not intended for life support applications.
All dimensions in inches. ? Copyright 2013 The Connor-Winfield Corporation
Bulletin
Page
Revision
Date
Cx210
4 of 6
14
19 Nov 2013
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