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参数资料
| 型号： | P1014 |
| 元件分类： | 放大器 |
| 英文描述： | 8500 MHz - 11000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | DIE-6 |
| 文件页数： | 3/5页 |
| 文件大小： | 179K |
| 代理商： | P1014 |
Velocium Products
18 - 20 GHz HPA
- APH478
Page 3 of 5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
P1014
8.5-11.0 GHz GaAs MMIC
Power Amplifier
Mechanical Drawing
Bias Arrangement
Bypass Capacitors - See App Note [2]
(Note: Engineering designator is I0005129)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.120 x 0.200 (0.005 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.778 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg)
Bond Pad #6 (Vgg)
1.400
(0.055)
1
2
3
4
5
6
1.962
(0.077)
2.412
(0.095)
1.962
(0.077)
3.200
(0.126)
1.662
(0.065)
0.0
0.449
(0.018)
0.449
(0.018)
1
2
3
4
5
6
Vd1
RF In
RF Out
Vgg
Vd2
XP1014
Mimix Broadband
I0005129
TNO 2005
XP1014
Mimix Broadband
I0004966
TNO 2005
August 2005 - Rev 03-Aug-05
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