- 您现在的位置：买卖IC网 > PDF目录367750 > PA28F400B5B80 (INTEL CORP) SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT PDF资料下载
参数资料
| 型号： | PA28F400B5B80 |
| 厂商： | INTEL CORP |
| 元件分类： | PROM |
| 英文描述： | SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT |
| 中文描述： | 512K X 8 FLASH 5V PROM, 80 ns, PDSO44 |
| 封装： | 0.525 X 1.110 INCH, PLASTIC, SOP-44 |
| 文件页数： | 6/38页 |
| 文件大小： | 501K |
| 代理商： | PA28F400B5B80 |
第1页第2页第3页第4页第5页当前第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页
SMART 5 BOOT BLOCK MEMORY FAMILY
E
6
ADVANCE INFORMATION
SmartVoltage technology enables fast factory
programming and low-power designs. Specifically
designed for 5 V systems, Smart 5 components
support read operations at 5 V V
CC
and internally
configure to program/erase at 5 V or 12 V. The 12 V
V
PP
option renders the fastest program and erase
performance which will increase your factory
throughput. With the 5 V V
PP
option, V
CC
and V
PP
can be tied together for a simple 5 V design. In
addition, the dedicated V
PP
pin gives complete data
protection when V
PP
≤
V
PPLK
.
The memory array is asymmetrically divided into
blocks
in
an
asymmetrical
accommodate microprocessors that boot from the
top (denoted by
-T
suffix) or the bottom (
-B
suffix)
of the memory map. The blocks include a
hardware-lockable boot block (16,384 bytes), two
parameter blocks (8,192 bytes each) and main
blocks (one block of 98,304 bytes and additional
block(s) of 131,072 bytes). See Figures 4
–7 for
memory maps. Each block can be independently
erased and programmed 100,000
commercial temperature or 10,000 times at
extended temperature. Unlike erase operations,
which
erase
all
locations
simultaneously, each byte or word in the flash
memory can be programmed independently of other
memory locations.
architecture
to
times
at
within
a
block
The
complete code security for the kernel code required
for system initialization. Locking and unlocking of
the boot block is controlled by WP# and/or RP#
(see Section 3.3 for details).
hardware-lockable
boot
block
provides
The system processor interfaces to the flash device
through a Command User Interface (CUI), using
valid command sequences to initiate device
automation. An internal Write State Machine (WSM)
automatically executes the algorithms and timings
necessary for program and erase operations. The
Status Register (SR) indicates the status of the
WSM and whether it successfully completed the
desired program or erase operation.
The Automatic Power Savings (APS) feature
substantially reduces active current when the
device is in static mode (addresses not switching).
In APS mode, the typical I
CCR
current is 1 mA.
When CE# and RP# pins are at V
CC
, the
component enters a CMOS standby mode. Driving
RP# to GND enables a deep power-down mode
which significantly reduces power consumption,
provides write protection, resets the device, and
clears the status register. A reset time (t
PHQV
) is
required from RP# switching high until outputs are
valid. Likewise, the device has a wake time (t
PHEL
)
from RP#-high until writes to the CUI are
recognized. See Section 4.2.
The deep power-down mode can also be used as a
device reset, allowing the flash to be reset along
with the rest of the system. For example, when the
flash memory powers-up, it automatically defaults
to the read array mode, but during a warm system
reset, where power continues uninterrupted to the
system components, the flash memory could
remain in a non-read mode, such as erase.
Consequently, the system Reset signal should be
tied to RP# to reset the memory to normal read
mode upon activation of the Reset signal. This also
provides protection against unwanted command
writes due to invalid system bus conditions during
system reset or power-up/down sequences.
These devices are configurable at power-up for
either byte-wide or word-wide input/output using the
BYTE# pin. Please see Table 2
for a detailed
description of BYTE# operations, especially the
usage of the
DQ
15
/A
–1
pin.
These Smart 5 memory products are available in
the 44-lead PSOP (Plastic Small Outline Package),
which is ROM/EPROM-compatible, and the 48-lead
TSOP (Thin Small Outline Package, 1.2 mm thick)
as shown in Figure 1, and 2, respectively.
2.0
PRODUCT DESCRIPTION
This section describes the pinout and block
architecture of the device family.
2.1
Pin Descriptions
The pin descriptions table details the usage of each
of the device pins.
相关PDF资料 |
PDF描述 |
|---|---|
| PA28F800B5B90 | SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT |
| PA28F200B5T60 | SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT |
| PA28F400B5T60 | SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT |
| PA28F800B5T70 | SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT |
| PA28F200B5T80 | SMART 5 BOOT BLOCK FLASH MEMORY FAMILY 2, 4, 8 MBIT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PA28F400B5T60 | 制造商:Intel 功能描述: |
| PA28F400B5T80 | 制造商:Intel 功能描述:Flash Mem Parallel 5V 4M-Bit 512K x 8/256K x 16 80ns 44-Pin SOP |
| PA28F400BL-B150 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:4-MBlT (256K x 16, 512K x 8) LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY |
| PA28F400BL-T150 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:4-MBlT (256K x 16, 512K x 8) LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY |
| PA28F400BVB120 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:4-MBIT (256K X 16, 512K X 8)SmartVoltage BOOT BLOCK FLASH MEMORY FAMILY |
发布紧急采购，3分钟左右您将得到回复。