参数资料
型号: PACDN046MR
厂商: ON Semiconductor
文件页数: 13/14页
文件大小: 0K
描述: DIODE ZENER 8MSOP
产品变化通告: CMD Product Obsolescence 16/Mar/2011
标准包装: 4,000
电压 - 反向隔离(标准值): 5.5V
电极标记: 6 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 带卷 (TR)
PACDN042
PACKAGE DIMENSIONS
MSOP8
CASE 846AB
ISSUE O
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
H E
E
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
? T ?
PIN 1 ID
SEATING
PLANE
0.038 (0.0015)
e
b 8 PL
0.08 (0.003)
A
M
T B
S
A
S
DIM
A
A1
b
c
D
E
e
L
H E
MILLIMETERS
MIN NOM MAX
?? ?? 1.10
0.05 0.08 0.15
0.25 0.33 0.40
0.13 0.18 0.23
2.90 3.00 3.10
2.90 3.00 3.10
0.65 BSC
0.40 0.55 0.70
4.75 4.90 5.05
MIN
??
0.002
0.010
0.005
0.114
0.114
0.016
0.187
INCHES
NOM
??
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.193
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
A1
c
L
SOLDERING FOOTPRINT*
8X
1.04
0.041
3.20
0.126
0.38
0.015
8X
4.24
0.167
5.28
0.208
6X
0.65
0.0256
SCALE 8:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
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