参数资料
型号: PACDN046MR
厂商: ON Semiconductor
文件页数: 5/14页
文件大小: 0K
描述: DIODE ZENER 8MSOP
产品变化通告: CMD Product Obsolescence 16/Mar/2011
标准包装: 4,000
电压 - 反向隔离(标准值): 5.5V
电极标记: 6 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 带卷 (TR)
PACDN042
PACKAGE DIMENSIONS
SOT ? 23 (TO ? 236)
CASE 318 ? 08
ISSUE AP
3
D
SEE VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
E
A
A1
1
e
2
b
H E
L1
L
q
c
0.25
DIM
A
A1
b
c
D
E
e
L
L1
H E
q
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0 °
MILLIMETERS
NOM MAX
1.00 1.11
0.06 0.10
0.44 0.50
0.13 0.18
2.90 3.04
1.30 1.40
1.90 2.04
0.20 0.30
0.54 0.69
2.40 2.64
??? 10 °
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0 °
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
???
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10 °
VIEW C
SOLDERING FOOTPRINT
0.95
0.95
0.037
0.037
2.0
0.079
0.9
0.035
0.8
SCALE 10:1
mm
inches
0.031
http://onsemi.com
5
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