参数资料
| 型号： | PC410S0NIP0F |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 12/15页 |
| 文件大小： | 0K |
| 描述： | PHOTOCOUPLER 10MBIT/S 8-SMD |
| 产品目录绘图： | PC410, PC910 Circuit |
| 标准包装： | 1 |
| 系列： | OPIC™ |
| 电压 - 隔离： | 3750Vrms |
| 通道数： | 1，单向 |
| 电流 - 输出 / 通道： | 50mA |
| 数据速率： | 10Mbps |
| 传输延迟高 - 低 @ 如果： | 48ns @ 7.5mA |
| 电流 - DC 正向(If)： | 20mA |
| 输入类型： | DC |
| 输出类型： | 开路集电极 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-Miniflat |
| 包装： | 标准包装 |
| 产品目录页面： | 2770 (CN2011-ZH PDF) |
| 其它名称： | 425-2534-6 |
PC410S0NIP0F Series
■ Manufacturing Guidelines
● Soldering Method
Re ? ow Soldering:
Re ? ow soldering should follow the temperature pro ? le shown below.
Soldering should not exceed the curve of temperature pro ? le and time.
Please don't solder more than twice.
( ? C)
300
Terminal : 260 ? C peak
(package surface : 250 ? C peak)
200
Reflow
220 ? C or more, 60s or less
100
Preheat
150 to 180 ? C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in ? ow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270 ? C and within 10s.
Preheating is within the bounds of 100 to 150 ? C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400 ? C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works ? ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A09001EN
12
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