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| 型号： | PCA8575PW,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 19/30页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24TSSOP |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 1 |
| 接口： | I²C |
| 输入/输出数： | 16 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 标准包装 |
| 包括： | POR |
| 其它名称： | 568-8248-6 |
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PCA8575_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 21 March 2007
26 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I2C-bus with interrupt
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 28) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 7 and 8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 28.
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA8576C | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCA8576CH/Q900,157 | 功能描述:LCD 驱动器 UNIVERSAL LCD DRIVER LOW MULTIPLEX RATES RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
| PCA8576CH/Q900/1 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCA8576CH/Q900/1,1 | 功能描述:LCD 驱动器 MULT DIG/SEG 200KHz RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
| PCA8576CH/Q900/1,118 | 制造商:NXP Semiconductors 功能描述:Cut Tape 制造商:NXP Semiconductors 功能描述:0 |
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