- 您现在的位置：买卖IC网 > PDF目录20263 > PCA8576CH/Q900/1,1 (NXP Semiconductors)IC LCD DRIVER 40SEG I2C 64LQFP PDF资料下载
参数资料
| 型号： | PCA8576CH/Q900/1,1 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 43/54页 |
| 文件大小： | 0K |
| 描述： | IC LCD DRIVER 40SEG I2C 64LQFP |
| 产品培训模块： | I²C Bus Fundamentals |
| 标准包装： | 1 |
| 显示器类型： | LCD |
| 配置： | 40 段 |
| 接口： | I²C |
| 电流 - 电源： | 120µA |
| 电源电压： | 2 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-LQFP |
| 供应商设备封装： | 64-LQFP（10x10） |
| 包装： | 标准包装 |
| 其它名称： | 568-5122-6 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页当前第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页
NXP Semiconductors
PCA8576C
Automotive LCD driver for low multiplex rates
17.3 Wave soldering
Key characteristics in wave soldering are:
? Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 33 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature ( ? C)
Volume (mm 3 )
< 350
? 350
< 2.5
? 2.5
Table 20.
235
220
Lead-free process (from J-STD-020D)
220
220
Package thickness (mm)
Package reflow temperature ( ? C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
PCA8576C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 December 2013
? NXP B.V. 2013. All rights reserved.
43 of 54
相关PDF资料 |
PDF描述 |
|---|---|
| HR-AAAUF5 | BATT PACK 6.0V AAA 650MAH NIMH |
| T95R187M016CSAS | CAP TANT 180UF 16V 20% 2824 |
| VE-22W-CW | CONVERTER MOD DC/DC 5.5V 100W |
| HMM24DSAI | CONN EDGECARD 48POS R/A .156 SLD |
| GMM44DSXS | CONN EDGECARD 88POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA8576D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Automotive 40 x 4 LCD segment driver for low multiplex rates up to 1:4 |
| PCA8576DU | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Automotive 40 x 4 LCD segment driver for low multiplex rates up to 1:4 |
| PCA8576DU/2DA/Q2,0 | 功能描述:IC LCD DRIVER AUTO 40X4 UNCASED RoHS:是 类别:未定义的类别 >> 其它 系列:* 标准包装:1 系列:* 其它名称:MS305720A |
| PCA8576Q2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Automotive 40 x 4 LCD segment driver for low multiplex rates up to 1:4 |
| PCA8581 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:128 x 8-bit EEPROM with I2C-bus interface |
发布紧急采购，3分钟左右您将得到回复。