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参数资料
| 型号： | PCA9502BS,128 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 14/25页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C/SPI 24HVQFN |
| 标准包装： | 1,500 |
| 接口： | I²C，SPI |
| 输入/输出数： | 8 |
| 中断输出： | 无 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | 24-HVQFN（4x4） |
| 包装： | 带卷 (TR) |
| 其它名称： | 935281363128 PCA9502BS-F PCA9502BS-F-ND |
PCA9502_3
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 13 October 2006
21 of 25
NXP Semiconductors
PCA9502
8-bit I/O expander with I2C-bus/SPI interface
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 20) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 18 and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 20.
Table 18.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 19.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9502BS-F | 功能描述:接口-I/O扩展器 8-BITI/O EXPDR W/I2C-SPI INTRF RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9503A | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Smart, simple solutions for the 12 most common design concerns |
| PCA9504A | 功能描述:接口 - 专用 GLUE CHIP 4 RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| PCA9504ADGG | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Glue chip 4 |
| PCA9504ADGG,112 | 功能描述:接口 - 专用 GLUE CHIP 4 RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
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