参数资料
型号: PCA9539BS,118
厂商: NXP Semiconductors
文件页数: 20/37页
文件大小: 0K
描述: IC I/O EXPANDER I2C 16B 24HVQFN
产品培训模块: I²C Bus Fundamentals
特色产品: NXP - I2C Interface
标准包装: 1
接口: I²C,SM 总线
输入/输出数: 16
中断输出:
频率 - 时钟: 400kHz
电源电压: 2.3 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-VFQFN 裸露焊盘
供应商设备封装: 24-HVQFN(4x4)
包装: 标准包装
包括: POR
产品目录页面: 825 (CN2011-ZH PDF)
其它名称: 568-1841-6
PCA9539_PCA9539R
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 6 February 2013
27 of 37
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
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PCA9539BSHP 功能描述:I/O Expander 16 I2C 400kHz 24-HVQFN (4x4) 制造商:nxp semiconductors 系列:- 包装:剪切带(CT) 零件状态:停产 I/O 数:16 接口:I2C 中断输出:是 特性:POR 输出类型:开路漏极 电流 - 灌/拉输出:50mA 频率 - 时钟:400kHz 电压 - 电源:2.3 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商器件封装:24-HVQFN(4x4) 标准包装:1
PCA9539BS-T 制造商:NXP Semiconductors 功能描述:I2C/SMBus GPIO Expander 5.5V 24-Pin HVQFN EP T/R
PCA9539D 功能描述:接口-I/O扩展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
PCA9539D,112 功能描述:接口-I/O扩展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
PCA9539D,118 功能描述:接口-I/O扩展器 16-BIT I2C FM TP GPIO INT RST RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel