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| 型号： | PCA9552PW,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 23/28页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER BLINKER 24-TSSOP |
| 标准包装： | 2,500 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 16 |
| 内部驱动器： | 是 |
| 类型 - 主要： | LED 闪烁器 |
| 频率： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | 935272394118 PCA9552PW-T PCA9552PW-T-ND |
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Philips Semiconductors
PCA9552
16-bit I 2 C-bus LED driver with programmable blink rates
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ?ne pitch
SMDs. In these situations re?ow soldering is recommended.
15.2 Re?ow soldering
Re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for re?owing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical re?ow peak temperatures range from 215 ° C to 270 ° C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
? below 225 ° C (SnPb process) or below 245 ° C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm 3 so called
thick/large packages.
? below 240 ° C (SnPb process) or below 260 ° C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was speci?cally
developed.
If wave soldering is used the following conditions must be observed for optimal results:
PCA9552_5
? Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 9 March 2006
23 of 28
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9553 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
| PCA9553D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
| PCA9553D/01 | 功能描述:LED照明驱动器 LED DRVR 4BIT I2C RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9553D/01,112 | 功能描述:LED照明驱动器 LED DRVR 4BIT I2C RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9553D/01,118 | 功能描述:LED照明驱动器 4-BIT I2C FM OD LED BLK RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
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