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| 型号： | PCA9553D/01,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 21/26页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER LINEAR 8-SOIC |
| 标准包装： | 2,500 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 4 |
| 内部驱动器： | 是 |
| 类型 - 主要： | LED 闪烁器 |
| 频率： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | 935272825118 PCA9553D/01-T PCA9553D/01-T-ND |
NXP Semiconductors
PCA9553
4-bit I 2 C-bus LED driver with programmable blink rates
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount re?ow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ?ne pitch SMDs. Re?ow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and re?ow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
? Through-hole components
? Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The re?ow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature pro?le. Leaded packages,
packages with solder balls, and leadless packages are all re?ow solderable.
Key characteristics in both wave and re?ow soldering are:
?
?
?
?
?
?
Board speci?cations, including the board ?nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
PCA9553_6
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 29 December 2008
21 of 26
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9553D02 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
| PCA9553DP | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
| PCA9553DP/01 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C-bus LED driver with programmable blink rates |
| PCA9553DP/01,118 | 功能描述:LED照明驱动器 4BIT I2C FM OD LED BLK RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9553DP/01118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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