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| 型号： | PCA9553D/01,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 22/26页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER LINEAR 8-SOIC |
| 标准包装： | 2,500 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 4 |
| 内部驱动器： | 是 |
| 类型 - 主要： | LED 闪烁器 |
| 频率： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | 935272825118 PCA9553D/01-T PCA9553D/01-T-ND |
NXP Semiconductors
PCA9553
4-bit I 2 C-bus LED driver with programmable blink rates
? Process issues, such as application of adhesive and ?ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath speci?cations, including temperature and impurities
16.4 Re?ow soldering
Key characteristics in re?ow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free re?ow process usually leads to
higher minimum peak temperatures (see Figure 26 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classi?ed in accordance with
Table 15 and 16
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 16.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during re?ow
soldering, see Figure 26 .
PCA9553_6
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 29 December 2008
22 of 26
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9553D02 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
| PCA9553DP | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
| PCA9553DP/01 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C-bus LED driver with programmable blink rates |
| PCA9553DP/01,118 | 功能描述:LED照明驱动器 4BIT I2C FM OD LED BLK RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9553DP/01118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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