参数资料
| 型号： | PCA9555D,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 22/34页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24SOIC |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 30 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 16 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SO |
| 包装： | 管件 |
| 包括： | POR |
| 产品目录页面： | 826 (CN2011-ZH PDF) |
| 其它名称： | 568-1056-5 568-3985-5 935269567112 PCA9555D |
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PCA9555_8
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
29 of 34
NXP Semiconductors
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
15.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 32) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 16 and 17
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 32.
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9555DB,112 | IC I/O EXPANDER I2C 16B 24SSOP |
| PCA9555PW,112 | IC I/O EXPANDER I2C 16B 24TSSOP |
| 5-531478-4 | CONT.MINI-LEAF STRIP |
| 5-583857-5 | TWIN LEAF DUMMY CONTACT |
| 530505-8 | DUO-TYNE FLAG STRIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9555D112 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 16BIT 400KHZ SOIC-24 |
| PCA9555D118 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9555DB | 功能描述:接口-I/O扩展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9555DB,112 | 功能描述:接口-I/O扩展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9555DB,118 | 功能描述:接口-I/O扩展器 16-BIT I2C FM TP GPIO INT PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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