参数资料
| 型号： | PCA9555D,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 24/34页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24SOIC |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 30 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 16 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SO |
| 包装： | 管件 |
| 包括： | POR |
| 产品目录页面： | 826 (CN2011-ZH PDF) |
| 其它名称： | 568-1056-5 568-3985-5 935269567112 PCA9555D |
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PCA9555_8
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
30 of 34
NXP Semiconductors
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
16. Soldering of through-hole mount packages
16.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 32. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9555DB,112 | IC I/O EXPANDER I2C 16B 24SSOP |
| PCA9555PW,112 | IC I/O EXPANDER I2C 16B 24TSSOP |
| 5-531478-4 | CONT.MINI-LEAF STRIP |
| 5-583857-5 | TWIN LEAF DUMMY CONTACT |
| 530505-8 | DUO-TYNE FLAG STRIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9555D112 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 16BIT 400KHZ SOIC-24 |
| PCA9555D118 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9555DB | 功能描述:接口-I/O扩展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9555DB,112 | 功能描述:接口-I/O扩展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9555DB,118 | 功能描述:接口-I/O扩展器 16-BIT I2C FM TP GPIO INT PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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