参数资料
| 型号： | PCA9574HR,115 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 21/33页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16HXQFN |
| 产品培训模块： | I²C Bus Fundamentals |
| 标准包装： | 1 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 1.1 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-XFQFN 裸露焊盘 |
| 供应商设备封装： | 16-UHXQFN |
| 包装： | 标准包装 |
| 包括： | POR |
| 产品目录页面： | 826 (CN2011-ZH PDF) |
| 其它名称： | 568-4936-6 |
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PCA9574
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 25 April 2012
28 of 33
NXP Semiconductors
PCA9574
8-bit I2C-bus and SMBus, level translating, low volage GPIO
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16 and 17
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25.
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9574PW | 功能描述:转换 - 电压电平 8-BIT I2C-BUS/SMBUS GPIO TRANS RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| PCA9574PW,112 | 功能描述:转换 - 电压电平 8-BIT I2C-BUS/SMBUS RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| PCA9574PW,118 | 功能描述:转换 - 电压电平 8-BIT I2C-BUS/SMBUS RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| PCA9574PW-T | 功能描述:转换 - 电压电平 8-BIT I2C-BUS/SMBUS GPIO TRANS RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| PCA9575HF,118 | 功能描述:I2C 接口集成电路 16-BIT I2C-BUS SMBus LW Voltage GPIO RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
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