参数资料
| 型号： | PCA9621D,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 6/18页 |
| 文件大小： | 0K |
| 描述： | IC BUS OUTPUT PORT 2WIRE 16SOIC |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 1 |
| 接口： | I²C 总线，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 无 |
| 频率 - 时钟： | 1MHz |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SO |
| 包装： | 标准包装 |
| 其它名称： | 568-6671-6 |
PCA9621
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 9 March 2011
14 of 18
NXP Semiconductors
PCA9621
65 mA 8-bit 2-wire bus output port
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 16) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 5 and 6
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 16.
Table 5.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 6.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9536DP/DG,118 | IC I/O EXPANDER I2C 4B 8TSSOP |
| PCF8575TS/1,118 | IC I/O EXPANDER I2C 16B 24SSOP |
| PCA9539D,118 | IC I/O EXPANDER I2C 16B 24SOIC |
| PCA9555DB,118 | IC I/O EXPANDER I2C 16B 24SSOP |
| ATTINY13A-SFR | IC MCU AVR 1K FLASH 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9621PW,118 | 功能描述:数字总线开关 IC 65 mA 8-Bit 2-Wire Bus Output Port RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| PCA9622BS,118 | 功能描述:LED照明驱动器 16-BIT FM+ I2C-BUS 100MA 40V LED DRIVER RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9622DR | 制造商:NXP Semiconductors 功能描述:IC LED DRIVER RGBA 32-TSSOP 制造商:NXP Semiconductors 功能描述:IC, LED DRIVER, RGBA, 32-TSSOP 制造商:NXP Semiconductors 功能描述:IC, LED DRIVER, RGBA, 32-TSSOP; No. of Outputs:16; Output Current:100mA; Output Voltage:40V; Driver Case Style:TSSOP; Input Voltage Min:2.3V; Input Voltage Max:5.5V; Dimming Control Type:PWM; Switching Frequency:1MHz; Operating ;RoHS Compliant: Yes |
| PCA9622DR,118 | 功能描述:LED照明驱动器 16-BIT FM+ I2C-BUS 100mA 40V LED driver RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9622DR,118-CUT TAPE | 制造商:NXP 功能描述:PCA9622 Series 100 mA 5.5 V 1 MHz SMT 16-bit I2C-Bus LED Driver - TSSOP-32 |
发布紧急采购，3分钟左右您将得到回复。