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| 型号： | PCA9633BS,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 39/43页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER RGBA 16-HVQFN |
| 产品培训模块： | LED Controllers I²C Bus Fundamentals |
| 标准包装： | 1 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 4 |
| 内部驱动器： | 两者兼有 |
| 类型 - 主要： | 背光，LED 闪烁器 |
| 类型 - 次要： | RGBA |
| 频率： | 25MHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 输出电压： | 5.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 供应商设备封装： | 16-HVQFN |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 产品目录页面： | 844 (CN2011-ZH PDF) |
| 配用： | OM6276,598-ND - DEMO BOARD PWM LED 622-1004-ND - BOARD DEMO FOR PHILIPS PCA9633 |
| 其它名称： | 568-3234-6 |
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NXP Semiconductors
PCA9633
4-bit Fm+ I 2 C-bus LED driver
? Process issues, such as application of adhesive and ?ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath speci?cations, including temperature and impurities
17.4 Re?ow soldering
Key characteristics in re?ow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free re?ow process usually leads to
higher minimum peak temperatures (see Figure 32 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classi?ed in accordance with
Table 22 and 23
Table 22.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 23.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during re?ow
soldering, see Figure 32 .
PCA9633_5
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 25 July 2008
39 of 43
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| PCA9633BS-T | 功能描述:LED照明驱动器 4BIT I2C FM+ TP LED CON RST OE RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9633D16 | 功能描述:LED照明驱动器 LED DRVR 4BIT I2C RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9633D16,112 | 功能描述:LED照明驱动器 LED DRVR 4BIT I2C RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9633D16,118 | 功能描述:LED照明驱动器 4BIT I2C FM+ TP LED CON RST OE RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9633DEMO | 功能描述:开发板和工具包 - 8051 Brd Philips PCA9633 RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:C8051F960, Si7005 核心: 接口类型:USB 工作电源电压: |
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