参数资料
| 型号： | PCA9674PW,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 24/40页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16TSSOP |
| 标准包装： | 96 |
| 接口： | I²C |
| 输入/输出数： | 8 |
| 中断输出： | 是 |
| 频率 - 时钟： | 1MHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
| 包括： | POR |
| 其它名称： | 935282735112 PCA9674PW PCA9674PW-ND |
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PCA9674_PCA9674A
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7 — 30 May 2013
30 of 40
NXP Semiconductors
PCA9674; PCA9674A
Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
Table 11.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 12.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9674PW-T | 功能描述:接口-I/O扩展器 8-BIT I2C FM+ QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9674TS | 功能描述:接口-I/O扩展器 8-BIT I2C FM+ QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9674TS,112 | 功能描述:接口-I/O扩展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9674TS,118 | 功能描述:接口-I/O扩展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9674TS-T | 功能描述:接口-I/O扩展器 8-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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