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参数资料
| 型号： | PCF8570T/F5,512 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC SRAM 2KBIT 100KHZ 8SOIC |
| 标准包装： | 64 |
| 格式 - 存储器： | RAM |
| 存储器类型： | SRAM |
| 存储容量： | 2K (256 x 8) |
| 速度： | 100kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.5 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
| 配用： | 568-3512-ND - DEMO BOARD UART TO I2C |
| 其它名称： | 935154920512 PCF8570TD PCF8570TD-ND |
Philips Semiconductors
256 × 8-bit static low-voltage RAM with
I 2 C-bus interface
Product speci?cation
PCF8570
15.4
Suitability of IC packages for wave, re?ow and dipping soldering methods
SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
REFLOW (1)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable (2)
?
suitable
Surface mount
BGA, SQFP
not suitable
suitable
?
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not
suitable (3)
suitable
?
PLCC (4) , SO, SOJ
suitable
suitable
?
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not
not
recommended (4)(5)
recommended (6)
suitable
suitable
?
?
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jan 06
17
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相关代理商/技术参数 |
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| PCF8571TD-T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Serial SRAM |
| PCF8573 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Clock/calendar with Power Fail Detector |
| PCF8573P | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Clock/calendar with Power Fail Detector |
| PCF8573PN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Real-Time Clock |
| PCF8573T | 制造商: 功能描述: 制造商:undefined 功能描述: 制造商:NXP Semiconductors 功能描述:Real Time Clock, 16 Pin, Plastic, SOP |
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